发明授权
US6023103A Chip-scale carrier for semiconductor devices including mounted spring
contacts
失效
用于包括安装的弹簧触点的半导体器件的芯片级载体
- 专利标题： Chip-scale carrier for semiconductor devices including mounted spring contacts
- 专利标题（中）： 用于包括安装的弹簧触点的半导体器件的芯片级载体
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申请号： US106943申请日： 1998-06-30
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公开(公告)号： US6023103A公开(公告)日： 2000-02-08
- 发明人: Sung Chul Chang , Igor Y. Khandros , William D. Smith
- 申请人： Sung Chul Chang , Igor Y. Khandros , William D. Smith
- 申请人地址： CA Livermore
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 当前专利权人地址： CA Livermore
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L29/417
摘要：
A plurality of free-standing resilient contact structures (spring elements) are mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se. The carrier substrate is pre-fabricated, by mounting the spring elements thereto prior to mounting the carrier substrate to the semiconductor device(s), or vice-versa.
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