公开(公告)号：US6023103A

公开(公告)日：2000-02-08

申请号：US106943

申请日：1998-06-30

申请人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

发明人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L29/417

CPC分类号： H01L23/3114 ,  H01L23/4951 ,  H01L23/49517 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L23/4985 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025

摘要： A plurality of free-standing resilient contact structures (spring elements) are mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se. The carrier substrate is pre-fabricated, by mounting the spring elements thereto prior to mounting the carrier substrate to the semiconductor device(s), or vice-versa.

摘要翻译： 多个独立的弹性接触结构（弹簧元件）被安装到载体基板的表面上。 载体衬底被安装到半导体器件的表面，或者一个或多个未起伏的半导体管芯。 半导体器件的接合焊盘通过在接合焊盘和与弹簧元件相关联的端子之间延伸的接合线连接到弹簧元件。 在半导体器件从形成它们的半导体晶片分离之前，将载体衬底安装到一个或多个半导体器件。 通过从载体基板本身延伸的弹簧元件提供弹性和顺应性来实现与半导体器件的压力连接。 在将载体衬底安装到半导体器件之前，通过将弹簧元件安装到其上来预先制造载体衬底，反之亦然。

公开(公告)号：US06168974A

公开(公告)日：2001-01-02

申请号：US09499963

申请日：2000-02-08

申请人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

发明人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

IPC分类号： H01L2144

CPC分类号： H01L23/3114 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A process for providing a plurality free-standing resilient contact structures (spring elements) mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se.

摘要翻译： 一种用于提供安装到载体基板的表面上的多个自立的弹性接触结构（弹簧元件）的方法。 载体衬底被安装到半导体器件的表面，或者一个或多个未起伏的半导体管芯。 半导体器件的接合焊盘通过在接合焊盘和与弹簧元件相关联的端子之间延伸的接合线连接到弹簧元件。 载体衬底在半导体器件被从形成它们的半导体晶片分离之前被安装到一个或多个半导体器件上。由载体衬底延伸的弹簧元件提供抵抗半导体器件的压力连接的弹性和顺应性， 本身。

公开(公告)号：US06797541B2

公开(公告)日：2004-09-28

申请号：US10302334

申请日：2002-11-22

申请人： DoSung Chun ,  Sung Chul Chang

发明人： DoSung Chun ,  Sung Chul Chang

IPC分类号： H01L2148

CPC分类号： H01L23/3114 ,  H01L21/4828 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/181 ,  Y10T29/4914 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional windowed housing which uniquely seals and provides a mechanism for viewing the internally packaged integrated semiconductor circuits (chips/die). A uniquely stamped and/or bent lead-frame is packaged by a polymeric material during a unique compression-molding process using a mold, specially contoured to avoid the common “over-packaging” problem in related art techniques. The specially contoured mold facilitates delineation of the internal portions from the external portions of the lead-frame, as the external portions are the effective solderable areas that contact pads on a printed circuit board, thereby avoiding a laborious environmentally-unfriendly masking step and de-flashing step, streamlining the device packaging process. The compression-mold effectively provides a compressive sealing orifice from which the effective solderable areas of the lead-frame may extend and be exposed and, thus, avoid being coated with the polymer which is uniquely contained by the mold for packaging the internal portions of the lead-frame. The lead-frame is uniquely stamped and/or bent, conforming it to electro-mechanical requirements of a particular semiconductor product. By uniquely stamping and/or bending, the related art “half-etching” of the lead for conforming it to electromechanical requirements of the packaged semiconductor product is no longer required. Environmental enhancement is achieved by conserving natural resources and by eliminating hazardous material by-products otherwise liberated in related art packaging techniques.

摘要翻译： 一种自然资源保守，环保，成本有效的无引线半导体封装设备，具有优越的机械和电气性能，并具有可选的窗户外壳，其独特地密封并提供用于观察内部封装的集成半导体电路（芯片 /死）。 独特的冲压和/或弯曲的引线框架在使用模具的独特的压缩成型工艺期间由聚合物材料包装，其特别是具有轮廓以避免现有技术中常见的“过度包装”问题。 由于外部是与印刷电路板上的焊盘接触的有效的可焊接区域，所以特别成型的模具有助于从引线框架的外部部分描绘内部部分，从而避免了难以对环境不利的屏蔽步骤和脱模， 闪烁一步，精简设备包装过程。 压缩模有效地提供了压缩密封孔，引线框架的有效可焊接区域可从该压缩密封孔延伸并露出，因此避免被模具唯一地包含的聚合物涂覆，以将包装的内部部分 引线框架。 引线框架是独特的冲压和/或弯曲，符合特定半导体产品的机电要求。 通过独特的冲压和/或弯曲，不再需要相关领域的“半蚀刻”，以使其符合封装半导体产品的机电要求。 通过保护自然资源和消除有害物质副产品，在现有技术的包装技术中解放出来，实现环境改善。

公开(公告)号：US06525405B1

公开(公告)日：2003-02-25

申请号：US09668423

申请日：2000-10-06

申请人： DoSung Chun ,  Sung Chul Chang

发明人： DoSung Chun ,  Sung Chul Chang

IPC分类号： H05K720

CPC分类号： H01L23/3114 ,  H01L21/4828 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/181 ,  Y10T29/4914 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional windowed housing which uniquely seals and provides a mechanism for viewing the internally packaged integrated semiconductor circuits (chips/die). A uniquely stamped and/or bent lead-frame is packaged by a polymeric material during a unique compression-molding process using a mold, specially contoured to avoid the common “over-packaging” problem in related art techniques. The specially contoured mold facilitates delineation of the internal portions from the external portions of the lead-frame, as the external portions are the effective solderable areas that contact pads on a printed circuit board, thereby avoiding a laborious environmentally-unfriendly masking step and de-flashing step, streamlining the device packaging process. The compression-mold effectively provides a compressive sealing orifice from which the effective solderable areas of the lead-frame may extend and be exposed and, thus, avoid being coated with the polymer which is uniquely contained by the mold for packaging the internal portions of the lead-frame. The lead-frame is uniquely stamped and/or bent, conforming it to electro-mechanical requirements of a particular semiconductor product. By uniquely stamping and/or bending, the related art “half-etching” of the lead for conforming it to electro-mechanical requirements of the packaged semiconductor product is no longer required. Environmental enhancement is achieved by conserving natural resources and by eliminating hazardous material by-products otherwise liberated in related art packaging techniques.

摘要翻译： 一种自然资源保守，环保，成本有效的无引线半导体封装设备，具有优越的机械和电气性能，并具有可选的窗户外壳，其独特地密封并提供用于观察内部封装的集成半导体电路（芯片 /死）。 独特的冲压和/或弯曲的引线框架在使用模具的独特的压缩成型工艺期间由聚合物材料包装，其特别是具有轮廓以避免现有技术中常见的“过度包装”问题。 由于外部是与印刷电路板上的焊盘接触的有效的可焊接区域，所以特别成型的模具有助于从引线框架的外部部分描绘内部部分，从而避免了难以对环境不利的屏蔽步骤和脱模， 闪烁一步，精简设备包装过程。 压缩模有效地提供了压缩密封孔，引线框架的有效可焊接区域可从该压缩密封孔延伸并露出，因此避免被模具唯一地包含的聚合物涂覆，以将包装的内部部分 引线框架。 引线框架是独特的冲压和/或弯曲，符合特定半导体产品的机电要求。 通过独特的冲压和/或弯曲，相关技术的“半蚀刻”不再需要用于使其符合封装半导体产品的机电要求。 通过保护自然资源和消除有害物质副产品，在现有技术的包装技术中解放出来，实现环境改善。