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    Chip-scale carrier for semiconductor devices including mounted spring contacts
    1.
    发明授权
    Chip-scale carrier for semiconductor devices including mounted spring contacts 失效
    用于包括安装的弹簧触点的半导体器件的芯片级载体

    公开(公告)号：US6023103A

    公开(公告)日：2000-02-08

    申请号：US106943

    申请日：1998-06-30

    申请人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

    发明人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L29/417

    CPC分类号： H01L23/3114 ,  H01L23/4951 ,  H01L23/49517 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L23/4985 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025

    摘要： A plurality of free-standing resilient contact structures (spring elements) are mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se. The carrier substrate is pre-fabricated, by mounting the spring elements thereto prior to mounting the carrier substrate to the semiconductor device(s), or vice-versa.

    摘要翻译： 多个独立的弹性接触结构（弹簧元件）被安装到载体基板的表面上。 载体衬底被安装到半导体器件的表面，或者一个或多个未起伏的半导体管芯。 半导体器件的接合焊盘通过在接合焊盘和与弹簧元件相关联的端子之间延伸的接合线连接到弹簧元件。 在半导体器件从形成它们的半导体晶片分离之前，将载体衬底安装到一个或多个半导体器件。 通过从载体基板本身延伸的弹簧元件提供弹性和顺应性来实现与半导体器件的压力连接。 在将载体衬底安装到半导体器件之前，通过将弹簧元件安装到其上来预先制造载体衬底，反之亦然。

    Process of mounting spring contacts to semiconductor devices
    2.
    发明授权
    Process of mounting spring contacts to semiconductor devices 失效
    将弹簧触点安装到半导体器件的过程

    公开(公告)号：US06168974A

    公开(公告)日：2001-01-02

    申请号：US09499963

    申请日：2000-02-08

    申请人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

    发明人： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

    IPC分类号： H01L2144

    CPC分类号： H01L23/3114 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A process for providing a plurality free-standing resilient contact structures (spring elements) mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se.

    摘要翻译： 一种用于提供安装到载体基板的表面上的多个自立的弹性接触结构（弹簧元件）的方法。 载体衬底被安装到半导体器件的表面，或者一个或多个未起伏的半导体管芯。 半导体器件的接合焊盘通过在接合焊盘和与弹簧元件相关联的端子之间延伸的接合线连接到弹簧元件。 载体衬底在半导体器件被从形成它们的半导体晶片分离之前被安装到一个或多个半导体器件上。由载体衬底延伸的弹簧元件提供抵抗半导体器件的压力连接的弹性和顺应性， 本身。

    Lithographically defined microelectronic contact structures
    10.
    发明授权
    Lithographically defined microelectronic contact structures 失效
    光刻定义的微电子接触结构

    公开(公告)号：US07714235B1

    公开(公告)日：2010-05-11

    申请号：US09539287

    申请日：2000-03-30

    申请人： David V. Pedersen ,  Igor Y. Khandros

    发明人： David V. Pedersen ,  Igor Y. Khandros

    IPC分类号： H01R12/04 ,  H05K1/11

    CPC分类号： H05K3/4092 ,  G01R1/06727 ,  G01R1/06761 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K2201/0311 ,  H05K2201/0347 ,  H01L2924/00

    摘要： Microelectronic contact structures (260, 360, 460) are lithographically defined and fabricated by applying a masking layer (220, 320, 420) on a surface of a substrate (202, 302, 402) such as an electronic component, creating an opening (222, 322, 422) in the masking layer, depositing a conductive trace of a seed layer (250, 350, 450) onto the masking layer and into the openings, and building up a mass of conductive material on the conductive trace. The sidewalls of the opening can be sloped (tapered). The conductive trace can be patterned by depositing material through a stencil or shadow mask (240, 340, 440). A protruding feature (230, 430) may be disposed on the masking layer so that a tip end (264, 364, 464) of the contact structure acquires a topography. All of these elements can be constructed as a group to form a plurality of precisely positioned resilient contact structures.

    摘要翻译： 微电子接触结构（260,360,460）通过在诸如电子部件的基板（202,302,402）的表面上施加掩模层（220,320,420）而光刻地限定和制造，从而产生开口 222,322,422），将掩蔽层上的种子层（250,350,450）的导电迹线沉积到所述开口中，并在所述导电迹线上建立一块导电材料。 开口的侧壁可以是倾斜的（渐缩的）。 导电迹线可以通过沉积材料通过模板或荫罩（240,340,440）进行图案化。 可以在掩蔽层上设置突出特征（230,430），使得接触结构的末端（264,364,464）获取形貌。 所有这些元件可以被构造成一组以形成多个精确定位的弹性接触结构。