发明授权
- 专利标题： Thin type semiconductor package
- 专利标题（中）： 薄型半导体封装
-
申请号： US890633申请日： 1997-07-09
-
公开(公告)号： US06054774A公开(公告)日： 2000-04-25
- 发明人: Jun Ohmori , Hiroshi Iwasaki
- 申请人： Jun Ohmori , Hiroshi Iwasaki
- 申请人地址： JPX
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX
- 优先权： JPX6-050758 19940322
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; G06K19/077 ; H01L23/31 ; H01L23/498 ; H01L29/41
摘要：
A semiconductor package having a board, at least one semiconductor chip, and flat type external connecting terminals, the board having a wiring circuit including connecting portions on a first main surface, the semiconductor being mounted on the first main surface, the flat type external connecting terminals being electrically connected to the semiconductor chip and formed on a second main surface of the board, wherein the flat type external connecting terminals are disposed in such a manner that any straight line which is arbitrarily drawn across the surface of a region to form the flat type external connecting terminals of the board runs on at least one of the flat type external connecting terminals.
公开/授权文献
- US5228542A Caliper brake for a bicycle wheel 公开/授权日：1993-07-20