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    Stacked semiconductor device and semiconductor system
    3.
    发明授权
    Stacked semiconductor device and semiconductor system 失效
    堆叠半导体器件和半导体系统

    公开(公告)号：US06492718B2

    公开(公告)日：2002-12-10

    申请号：US09739256

    申请日：2000-12-19

    申请人： Jun Ohmori

    发明人： Jun Ohmori

    IPC分类号： H01L2302

    CPC分类号： H01L24/97 ,  H01L25/105 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1627 ,  H01L2924/3025

    摘要： A stacked semiconductor device includes a plurality of stacked wiring substrates each having connection electrodes and wires connected to the connection electrodes and each mounted with a semiconductor device, a plurality of conductive via boards each interposed between adjacent two wiring substrates and having an opening for enclosing the semiconductor device, an uppermost wiring substrate formed on the top of the stacked wiring substrates and having wires connected to the connection electrodes, and a lowermost wiring substrate formed under the stacked wiring substrates and having wires connected to the connection electrodes, wherein heat radiation/shield conductive layers are formed on the uppermost and lowermost wiring substrates.

    摘要翻译： 堆叠半导体器件包括多个层叠的布线基板，每个堆叠的布线基板具有连接电极和连接到连接电极并且每个安装有半导体器件的布线，多个导电通孔板，每个导电通孔插入相邻的两个布线基板之间，并且具有用于封闭 半导体器件，形成在堆叠的布线基板的顶部上并且具有连接到连接电极的导线的最上面的布线基板，以及形成在堆叠的布线基板下方并且具有连接到连接电极的布线的最下面的布线基板，其中散热/屏蔽 导电层形成在最上层和最下层布线基板上。

    Method of mounting a plurality of semiconductor devices in corresponding supporters
    7.
    发明授权
    Method of mounting a plurality of semiconductor devices in corresponding supporters 失效
    将多个半导体器件安装在相应的支持者中的方法

    公开(公告)号：US5956601A

    公开(公告)日：1999-09-21

    申请号：US839358

    申请日：1997-04-17

    申请人： Sumie Sato ,  Jun Ohmori

    发明人： Sumie Sato ,  Jun Ohmori

    IPC分类号： G06K19/077 ,  H01L21/68 ,  H01L23/00 ,  H01L23/31 ,  H01L21/30 ,  H01L21/46

    CPC分类号： H01L21/6835 ,  G06K19/07745 ,  H01L23/3121 ,  H01L23/562 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/181

    摘要： A method of manufacturing a semiconductor device mountable in a module supporter. According to the present invention, a semiconductor substrate has a plurality of semiconductor modules, where each semiconductor module has a semiconductor chip covered with a protective material, such as resin, on a first surface and a connector formed on a second surface which is electrically connected to the semiconductor chip. An adhesive layer is applied to the first surface of the substrate. The adhesive layer has a plurality of opening portions arranged to positionally correspond to the plurality of semiconductor modules on the substrate. The substrate and the adhesive layer are cut into individual substrates each having the semiconductor chip so that each semiconductor module has the adhesive layer on a periphery of the protective material. Individual substrates containing a semiconductor module are bonded to the supporter having a concave portion for holding the semiconductor module.

    摘要翻译： 一种制造安装在模块支架中的半导体器件的方法。 根据本发明，半导体衬底具有多个半导体模块，其中每个半导体模块具有覆盖有诸如树脂的保护材料的半导体芯片在第一表面上，并且连接器形成在电连接的第二表面上 到半导体芯片。 将粘合剂层施加到基底的第一表面。 粘合剂层具有多个开口部分，其布置成与衬底上的多个半导体模块位置对应。 将基板和粘合剂层切割成各自具有半导体芯片的单个基板，使得每个半导体模块在保护材料的周围具有粘合剂层。 含有半导体模块的单个基板被结合到具有用于保持半导体模块的凹部的支撑件。

    Thin type semiconductor package
    10.
    发明授权
    Thin type semiconductor package 失效
    薄型半导体封装

    公开(公告)号：US06054774A

    公开(公告)日：2000-04-25

    申请号：US890633

    申请日：1997-07-09

    申请人： Jun Ohmori ,  Hiroshi Iwasaki

    发明人： Jun Ohmori ,  Hiroshi Iwasaki

    IPC分类号： H01L23/12 ,  G06K19/077 ,  H01L23/31 ,  H01L23/498 ,  H01L29/41

    CPC分类号： H01L23/49855 ,  G06K19/07743 ,  H01L23/3121 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/18161

    摘要： A semiconductor package having a board, at least one semiconductor chip, and flat type external connecting terminals, the board having a wiring circuit including connecting portions on a first main surface, the semiconductor being mounted on the first main surface, the flat type external connecting terminals being electrically connected to the semiconductor chip and formed on a second main surface of the board, wherein the flat type external connecting terminals are disposed in such a manner that any straight line which is arbitrarily drawn across the surface of a region to form the flat type external connecting terminals of the board runs on at least one of the flat type external connecting terminals.

    摘要翻译： 一种具有板，至少一个半导体芯片和平面型外部连接端子的半导体封装，所述板具有布线电路，所述布线电路包括在第一主表面上的连接部分，所述半导体安装在所述第一主表面上，所述平面型外部连接 端子电连接到半导体芯片并形成在板的第二主表面上，其中扁平型外部连接端子以这样的方式设置，即任意直线横过区域的表面而形成平面 板的外部连接端子至少在一个平面型外部连接端子上运行。