发明授权
US6059567A Semiconductor thermal processor with recirculating heater exhaust
cooling system
失效
具有循环加热器排气冷却系统的半导体热处理器
- 专利标题： Semiconductor thermal processor with recirculating heater exhaust cooling system
- 专利标题（中）： 具有循环加热器排气冷却系统的半导体热处理器
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申请号： US22057申请日： 1998-02-10
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公开(公告)号： US6059567A公开(公告)日： 2000-05-09
- 发明人: Douglas A. Bolton , Patrick W. Wiesen
- 申请人： Douglas A. Bolton , Patrick W. Wiesen
- 申请人地址： CA San Jose
- 专利权人： Silicon Valley Group, Inc.
- 当前专利权人： Silicon Valley Group, Inc.
- 当前专利权人地址： CA San Jose
- 主分类号： H01L21/324
- IPC分类号： H01L21/324 ; H01L21/00 ; F27D15/02
摘要：
In summary, the vertical rapid cooling furnace of this invention for treating semiconductor wafers with self contained gas chilling and recycling comprises a hot wall reaction tube positioned within a cylindrical array of heating coils. Space between the hot wall reaction tube and said array of heating coils provides a cooling gas passageway therebetween. The cooling gas passageway has an inlet and an outlet, a chilled gas inlet communicating with the inlet of the cooling gas passageway and a heated gas outlet communicating with the outlet of the cooling gas passageway. The furnace includes a heat exchanger having a hot gas inlet and a chilled gas outlet, the hot gas inlet thereof communicating with said heated gas outlet, and the chilled gas outlet communicating with said cooling gas passageway inlet. With this system, heated gas from the cooling gas passageway can be chilled to remove heat therefrom and returned to the cooling gas passageway to remove heat from the furnace. The furnace preferably includes a fan placed between the chilled gas outlet and the cooling gas passageway inlet and valves for isolating the heat exchanger from the furnace during its heating cycle.
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