发明授权
US6059887A Process for cleaning the interior of semiconductor substrate 失效
清洗半导体衬底内部的工艺

Process for cleaning the interior of semiconductor substrate
摘要:
A process of cleaning the interior of a semiconductor substrate containing metallic impurities therein is provided. The semiconductor substrate is heated, with one side or the both sides thereof being in contact with a melt of a metal or an inorganic salt, at a high temperature such that the melt does not react with these semiconductor and the semiconductor is not melted. By this process, the impurities present inside the substrate are removed out of the substrate and the interior thereof is cleaned.
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