发明授权
- 专利标题： Method for aligning a wafer
- 专利标题（中）： 对准晶片的方法
-
申请号： US893461申请日： 1997-07-11
-
公开(公告)号： US6063440A公开(公告)日： 2000-05-16
- 发明人: Ling Chen , Joseph Yudovsky , Ying Yu , Lawrence C. Lei
- 申请人： Ling Chen , Joseph Yudovsky , Ying Yu , Lawrence C. Lei
- 申请人地址： CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： CA Santa Clara
- 主分类号： C23C14/50
- IPC分类号： C23C14/50 ; C23C16/44 ; C23C16/458 ; H01L21/02 ; H01L21/205 ; H01L21/68 ; C23C16/00
摘要：
A method for aligning a wafer on a support member within a vacuum chamber includes increasing the pressure within the vacuum chamber to at least about 1 Torr before aligning the wafer. The wafer is introduced into the vacuum chamber on the support member, the pressure is increased to at least about one Torr, and the support member is lifted into a shadow ring that has a frustoconical inner cavity constructed to funnel the wafer to a centered, aligned position.
公开/授权文献
- USD342899S Trigger-actuated vaporizing pump 公开/授权日：1994-01-04
信息查询
IPC分类:
