A wound treatment apparatus is provided which includes a thermally conductive bandage, a heater in contact with the bandage over a wound treatment area, and an adhesive attachment device for maintaining thermally conductive contact between the heater and the bandage. The bandage and heater together have a low profile so as to be convenient for the patient and are flexible so as to conform to the shape of the wound and to the contours of the skin surrounding the wound. The attachment device is fashioned so as to have less pull strength than an adhesive holding the bandage to the person's body so that the heater can be easily removed without disturbing the attachment of the bandage to the person's body. The bandage is provided with a polymeric film for maintaining moisture at the wound site as well as enhancing the utility of the attachment device.