发明授权
- 专利标题: Polishing apparatus
- 专利标题(中): 抛光设备
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申请号: US215147申请日: 1998-12-18
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公开(公告)号: US6074276A公开(公告)日: 2000-06-13
- 发明人: Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
- 申请人: Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
- 申请人地址: JPX Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX8-122243 19960418
- 主分类号: B24B37/04
- IPC分类号: B24B37/04 ; B24B49/00 ; B24B55/00 ; B24B55/12 ; B24B57/02 ; H01L21/302 ; B24B7/24
摘要:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.
公开/授权文献
- US4894513A Heatable windshield temperature control 公开/授权日:1990-01-16