公开(公告)号：US11612983B2

公开(公告)日：2023-03-28

申请号：US17233115

申请日：2021-04-16

申请人： EBARA CORPORATION

发明人： Hiroshi Sotozaki ,  Tadakazu Sone

IPC分类号： B24B57/02 ,  B24B55/12 ,  B24B55/02 ,  B24B37/015 ,  B24B49/14 ,  B24B37/04 ,  B24B55/06 ,  B24B37/10

摘要： Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

公开(公告)号：US11472002B2

公开(公告)日：2022-10-18

申请号：US16784757

申请日：2020-02-07

申请人： EBARA CORPORATION

发明人： Hiroyuki Shinozaki ,  Hiroshi Aono ,  Tadakazu Sone ,  Kenji Shinkai ,  Hideo Aizawa

IPC分类号： B24B37/34 ,  B24B55/06 ,  B24B55/12 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L21/306

摘要： A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

公开(公告)号：US11040428B2

公开(公告)日：2021-06-22

申请号：US16420347

申请日：2019-05-23

申请人： MENZERNA POLISHING COMPOUNDS GMBH & CO. KG

发明人： Rudi Messmer

IPC分类号： B24C11/00 ,  B24B55/12 ,  B24C9/00 ,  B24D3/34 ,  C09G1/02

摘要： A method for the surface treatment of workpieces by means of abrasive media, and a surface treatment composition. The method comprises the steps of providing a treatment tool, providing an abrasive medium, supplying a workpiece having a surface to be treated, surface treating the workpiece, involving removal of material and producing waste products, and processing the waste products, wherein at least one of said steps comprises adding an additive to lower a self-ignition tendency on the part of the waste products, the additive comprising a salt, composed of a carbonate and/or of a halogen anion.

公开(公告)号：US11007621B2

公开(公告)日：2021-05-18

申请号：US15950070

申请日：2018-04-10

申请人： EBARA CORPORATION

发明人： Hiroshi Sotozaki ,  Tadakazu Sone

IPC分类号： B24B57/02 ,  B24B55/12 ,  B24B55/02 ,  B24B37/015 ,  B24B49/14 ,  B24B37/04 ,  B24B55/06 ,  B24B37/10

摘要： Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

公开(公告)号：US10576604B2

公开(公告)日：2020-03-03

申请号：US14699075

申请日：2015-04-29

申请人： EBARA CORPORATION

发明人： Hiroyuki Shinozaki ,  Hiroshi Aono ,  Tadakazu Sone ,  Kenji Shinkai ,  Hideo Aizawa

IPC分类号： B24B55/12 ,  B24B37/34 ,  B24B55/06 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L21/306

摘要： A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

公开(公告)号：US10460947B2

公开(公告)日：2019-10-29

申请号：US15528237

申请日：2015-11-25

申请人： SHIN-ETSU HANDOTAI CO., LTD.

发明人： Masanao Sasaki ,  Hiromasa Hashimoto ,  Kei Fujiyama

IPC分类号： H01L21/304 ,  B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B55/12

摘要： The present invention is method for polishing silicon wafer, the method including recovering used slurry containing polishing abrasive grains that have been supplied to the silicon wafer and used for polishing, and circulating and supplying the recovered used slurry to the silicon wafer to polish the silicon wafer, wherein mixed alkali solution containing chelating agent and either or both of a pH adjuster and a polishing rate accelerator is added to the recovered used slurry without adding unused polishing abrasive grains, and the recovered used slurry is circulated and supplied to the silicon wafer to polish the silicon wafer. As a result, there is provided a method for polishing a silicon wafer that can suppress the occurrence of metal impurity contamination and stabilize the composition (e.g., the concentration of the chelating agent) of the used slurry when the used slurry is circulated and supplied to the silicon wafer for polishing.

公开(公告)号：US08887348B2

公开(公告)日：2014-11-18

申请号：US13392122

申请日：2010-08-25

申请人： Rainer Kenter ,  Rudolf Franke

发明人： Rainer Kenter ,  Rudolf Franke

IPC分类号： A47L11/292 ,  A47L7/02 ,  A47L11/30 ,  A47L11/20 ,  A47L11/40 ,  B24B7/18 ,  B24B55/12 ,  A47L11/16

CPC分类号： A47L11/40 ,  A47L11/161 ,  A47L11/305 ,  A47L11/4005 ,  A47L11/4013 ,  A47L11/4016 ,  A47L11/4022 ,  A47L11/4044 ,  A47L11/4052 ,  A47L11/4061 ,  A47L11/4075 ,  A47L11/4077 ,  A47L11/4083 ,  A47L11/4088 ,  B24B7/18 ,  B24B55/12

摘要： The invention relates to a handheld floor treatment device, comprising a floor part (1), which has a liquid supply (11), and a liquid in-take (13) and a structurally separated suction unit that contains at least one suction turbine (17). The invention further relates to a handheld floor treatment device, comprising a floor part (1) having a bow (5), which encompasses the floor part (1) at least in some sections and which is connected to the floor part (1) by means of a first joint (4) that can be adjusted in the treatment direction (6), and further comprising a guide part (2) attached to the bow (5), the guide part having a handle (3). The guide part (2) comprises a further joint (8) at the lower end below the center but above the floor part (1), about which joint the guide part (2) can be adjusted transversely to the treatment direction (6) so that the floor part (1) can be rotated by a user (P) parallel to the treatment surface (B) about a vertical axis (A1) of the floor part (1) by at least ±45°, even if the guide part (2) is in a tilted position.

摘要翻译： 本发明涉及一种手持地板处理装置，其包括具有液体供应装置（11）的底板部分（1）和液体承载装置（13）以及结构上分离的抽吸装置，该抽吸装置包含至少一个抽吸涡轮机 17）。 本发明还涉及一种手持地板处理装置，其包括具有弓形（5）的地板部分（1），其至少在一些部分中包围地板部分（1），并且通过以下方式连接到地板部分（1）： 可在治疗方向（6）上调整的第一关节（4）的装置，还包括附接到弓（5）的引导部分（2），引导部分具有手柄（3）。 引导部分（2）包括在中心下方但在地板部分（1）下方的下端的另一接头（8），引导部分（2）可围绕该接头横向于处理方向（6）进行调节 即使引导部分（1）能够平行于处理表面（B）的地板部分（1）围绕地板部分（1）的垂直轴线（A1）旋转至少±45°， （2）处于倾斜位置。

公开(公告)号：US06966821B2

公开(公告)日：2005-11-22

申请号：US10372224

申请日：2003-02-25

申请人： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

发明人： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Seiji Ishikawa ,  Manabu Tsujimura

IPC分类号： B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B51/00 ,  B24B55/12 ,  F24F3/16 ,  H01L21/00 ,  H01L21/677 ,  H03M13/39 ,  H04L1/00 ,  H04N5/44 ,  H04N5/455 ,  B24B1/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US6141812A

公开(公告)日：2000-11-07

申请号：US189985

申请日：1998-11-12

申请人： Naoki Matsuda ,  Kenya Ito

发明人： Naoki Matsuda ,  Kenya Ito

IPC分类号： B24B55/12 ,  B08B3/04 ,  H01L21/00

CPC分类号： H01L21/67051 ,  B08B1/007 ,  B08B3/04 ,  H01L21/67046

摘要： A rinsing apparatus comprising a rinsing sink for rinsing an article brought thereinto with a rinsing liquid which is continuously supplied thereinto, and a carrier for carrying an article to be rinsed. The rinsing sink is provided with a drain hole in the bottom wall of the sink. The carrier is adapted to move between a rinsing position where the article is positioned close to an inlet of the drain hole, thereby restricting a flow path from the sink to the drain hole so that the rinsing liquid continuously supplied into the sink fills and then overflows from the sink while a flow of the rinsing liquid through the restricted flow path is maintained, and a retracted position where the article is positioned out of the sink to allow the rinsing liquid to flow through the flow path into the drain hole without the restriction by the article.

摘要翻译： 一种漂洗装置，包括用于冲洗其中连续供应的冲洗液体的物品的冲洗槽和用于承载要冲洗的物品的载体。 冲洗槽在水槽底壁设有排水孔。 载体适于在物品靠近排水孔的入口定位的冲洗位置之间移动，从而限制从水槽到排水孔的流动路径，使得连续供应到水槽中的冲洗液体填满然后溢出 从冲洗液体流过限制流路的同时保持冲洗液体的流动以及物品位于水槽外的缩回位置，以使冲洗液体能够通过流路流入排水孔，而不受 文章。

公开(公告)号：US06139680A

公开(公告)日：2000-10-31

申请号：US212371

申请日：1998-12-15

申请人： Chien-Hung Chen ,  Hsueh-Chung Chen

发明人： Chien-Hung Chen ,  Hsueh-Chung Chen

IPC分类号： B01D46/00 ,  B24B37/04 ,  B24B55/12 ,  C23F1/02

CPC分类号： B24B55/12 ,  B01D46/00 ,  B24B37/04

摘要： An improved exhaust line of a chemical-mechanical polisher will improve polishing performance. A chemical-mechanical polisher is in a polishing chamber, wherein the chemical-mechanical polisher contains a polishing table, a plurality of polishing pads on the polishing table, and a plurality of outlets on the polishing table. A plurality of exhaust lines is connected with the plurality of the outlets, wherein the exhaust lines are used to drive out exhaust gas and sewage generated in the polishing chamber. At least a gas-liquid separating device is connected with the plurality of the exhaust lines, wherein the gas-liquid separating device is used for separation of the exhaust and the sewage. The gas-liquid separating device comprises a sewage collector, a filter, a pump, and a sewage-collecting device. The sewage collector is connected with the plurality of the outlets, wherein the sewage collector is used for collecting the exhaust gas and the sewage driven out through the plurality of outlets. The filter is connected with the top of the gas-liquid separating device. The pump is connected with the filter. The sewage-collecting device is connected with the bottom of the gas-liquid separating device, wherein the sewage-collecting device is used for collecting the sewage.

摘要翻译： 化学机械抛光机的改进的排气管线将提高抛光性能。 化学机械抛光机在抛光室中，其中化学机械抛光机包含抛光台，抛光台上的多个抛光垫和抛光台上的多个出口。 多个排气管路与多个出口连接，其中排气管线用于驱除在抛光室中产生的废气和污水。 至少一个气液分离装置与多个排气管连接，其中气液分离装置用于分离废气和污水。 气液分离装置包括污水收集器，过滤器，泵和污水收集装置。 污水收集器与多个出口连接，其中污水收集器用于收集废气，并通过多个出口排出污水。 过滤器与气液分离装置的顶部连接。 泵与过滤器连接。 污水收集装置与气液分离装置的底部连接，其中污水收集装置用于收集污水。