公开(公告)号：US06992781B2

公开(公告)日：2006-01-31

申请号：US10389751

申请日：2003-03-18

申请人： Hiroyuki Okada ,  Miki Shibata ,  Tadahiro Echigo ,  Shigeki Naka ,  Hiroyoshi Onnagawa

发明人： Hiroyuki Okada ,  Miki Shibata ,  Tadahiro Echigo ,  Shigeki Naka ,  Hiroyoshi Onnagawa

IPC分类号： H01L27/15 ,  G01B11/28

CPC分类号： G01N21/8422 ,  G01B11/0658 ,  G01N21/64 ,  G01N2021/646

摘要： A method for measuring a relative thickness distribution of an organic thin film for use in an organic electroluminescence device comprises the steps of irradiating a predetermined region of the organic thin film with a light including an ultraviolet light, measuring the intensity of a fluorescence produced by the organic thin film in response to the light irradiation, and obtaining a film thickness of the predetermined region from the intensity of the fluorescence. Further, an apparatus for measuring a thickness distribution for use in an organic electroluminescence device has means for irradiating a predetermined region of the organic thin film with a light including an ultraviolet light, means for measuring the intensity of a fluorescence produced by the organic thin film, and means for obtaining the film thickness of the predetermined region from the intensity of the fluorescence.

公开(公告)号：US6074276A

公开(公告)日：2000-06-13

申请号：US215147

申请日：1998-12-18

申请人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

发明人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

IPC分类号： B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  B24B57/02 ,  H01L21/302 ,  B24B7/24

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  H01L21/302 ,  Y10T137/5762

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括用于抛光工件表面的抛光部分，用于清洁已经被抛光的工件的清洁部分，设置在用于检测在抛光部分中发生的液体泄漏的抛光部分中的第一液体泄漏传感器，以及 第二液体泄漏传感器，设置在清洁部分中，用于检测在清洁部分中发生的液体泄漏。 抛光装置还包括一个控制装置，用于当第一和第二液体泄漏传感器中的任何一个检测到液体泄漏时，停止向抛光部分或清洁部分供应液体泄漏。

公开(公告)号：US5885134A

公开(公告)日：1999-03-23

申请号：US843593

申请日：1997-04-16

申请人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

发明人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

IPC分类号： B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  B24B57/02 ,  H01L21/302 ,  B24B7/24

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  H01L21/302 ,  Y10T137/5762

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

公开(公告)号：USRE38215E1

公开(公告)日：2003-08-12

申请号：US09814060

申请日：2001-03-22

申请人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

发明人： Miki Shibata ,  Toyomi Nishi ,  Hidetaka Nakao ,  Tetsuji Togawa

IPC分类号： B24B724

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B55/00 ,  B24B55/12 ,  H01L21/302 ,  Y10T137/5762

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.