发明授权
US6076244A Heat treatment method of actuators for an ink jet printer head and
method for manufacturing an ink jet printer head
有权
用于喷墨打印机头的致动器的热处理方法和用于制造喷墨打印头的方法
- 专利标题: Heat treatment method of actuators for an ink jet printer head and method for manufacturing an ink jet printer head
- 专利标题(中): 用于喷墨打印机头的致动器的热处理方法和用于制造喷墨打印头的方法
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申请号: US190464申请日: 1998-11-12
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公开(公告)号: US6076244A公开(公告)日: 2000-06-20
- 发明人: Motonori Okumura , Takaichi Wada , Tadao Furuta , Shinsuke Yano , Tomohiro Yamada , Nobuo Takahashi
- 申请人: Motonori Okumura , Takaichi Wada , Tadao Furuta , Shinsuke Yano , Tomohiro Yamada , Nobuo Takahashi
- 申请人地址: JPX JPX
- 专利权人: Seiko Epson Corporation,NGK Insulators, Ltd.
- 当前专利权人: Seiko Epson Corporation,NGK Insulators, Ltd.
- 当前专利权人地址: JPX JPX
- 优先权: JPX9-315267 19971117
- 主分类号: B41J2/045
- IPC分类号: B41J2/045 ; B41J2/055 ; B41J2/16 ; H01L41/09 ; H04R17/08 ; H04R17/00 ; B32B31/14
摘要:
A method of manufacturing an actuator including an ink pump section made by forming a spacer plate with a plurality of window portions formed therein, a closure plate stacked on one side of the spacer plate for covering the window portions and a connection plate stacked on the other side of the spacer plate for covering the above window portions. These plates are formed as laminated ceramic green sheets that are later fired to form an integrated body. A piezoelectric/electrostrictive operating section composed of electrodes and a piezoelectric/electrostrictive layer is then formed on the outer surface of the closure plate. Thereafter, the actuator is pasted to a holding adhesive film and the holding adhesive film is stripped from the actuator after subjecting the actuator to a given inspection, if necessary, or to cutting into a given shape, if necessary. Subsequently, the actuator is heat-treated. Then, onto this actuator, an ink nozzle member with a plurality of nozzle holes is stacked and joined. The ink jet print head has a strong adhesive joint between the actuator and the ink nozzle member and improved liquid resistance.
公开/授权文献
- US4365214A Semiconductor mounting and matching assembly 公开/授权日:1982-12-21
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