发明授权
- 专利标题： Method of forming an adhesive connection
- 专利标题（中）： 形成粘合剂连接的方法
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申请号： US37252申请日： 1998-03-09
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公开(公告)号： US6077380A公开(公告)日： 2000-06-20
- 发明人: Donald J. Hayes , Mary W. Hartnett
- 申请人： Donald J. Hayes , Mary W. Hartnett
- 申请人地址： TX Plano
- 专利权人： MicroFab Technologies, Inc.
- 当前专利权人： MicroFab Technologies, Inc.
- 当前专利权人地址： TX Plano
- 主分类号： B01J2/00
- IPC分类号： B01J2/00 ; B22F1/00 ; B22F1/02 ; B22F9/14 ; B23K3/06 ; B23K35/02 ; C23C4/12 ; H01L21/48 ; H01L21/56 ; H01L21/60 ; H01L23/498 ; H05K3/10 ; H05K3/32 ; H05K3/34 ; H05K3/30
摘要：
Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.
公开/授权文献
- USD375346S Illuminated toilet seat 公开/授权日：1996-11-05
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