- 专利标题: Semiconductor device and production thereof
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申请号: US880445申请日: 1997-06-24
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公开(公告)号: US6080611A公开(公告)日: 2000-06-27
- 发明人: Hideo Miura , Shunji Moribe , Hisayuki Kato , Atsuyoshi Koike , Shuji Ikeda , Asao Nishimura
- 申请人: Hideo Miura , Shunji Moribe , Hisayuki Kato , Atsuyoshi Koike , Shuji Ikeda , Asao Nishimura
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX6-248310 19940919
- 主分类号: H01L21/8247
- IPC分类号: H01L21/8247 ; C23C16/24 ; C23C16/44 ; C23C16/455 ; C23C16/52 ; H01L21/20 ; H01L21/205 ; H01L21/28 ; H01L21/285 ; H01L21/336 ; H01L29/04 ; H01L29/49 ; H01L29/78 ; H01L29/788 ; H01L29/792 ; H01L31/18 ; H01L21/8238
摘要:
A semiconductor device containing a polycrystalline silicon thin film wherein crystal grains of the silicon thin film have mainly a columnar structure and a crystal orientation of individual crystal grains is almost in a uniform direction can be produced by depositing a non-impurity-doped silicon thin film or an impurity layer on an interface of underlying film, followed by deposition of impurity-doped silicon thin film, if necessary, followed by heat treatment for polycrystallization.
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