发明授权
- 专利标题： Method of manufacturing a tape carrier with bump
- 专利标题（中）： 制造具有凹凸的带状载体的方法
-
申请号： US167012申请日： 1998-10-06
-
公开(公告)号： US6100112A公开(公告)日： 2000-08-08
- 发明人: Toshiaki Amano , Toshiaki Asada , Masakazu Hamada
- 申请人： Toshiaki Amano , Toshiaki Asada , Masakazu Hamada
- 申请人地址： JPX Tokyo
- 专利权人： The Furukawa Electric Co., Ltd.
- 当前专利权人： The Furukawa Electric Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX10-147753 19980528; JPX10-147754 19980528
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/56 ; H01L21/60 ; H01L23/498 ; H05K3/00 ; H05K3/06 ; H05K3/24 ; H05K3/34 ; H05K3/40 ; H01L21/44 ; H01L21/50
摘要：
A bump-attached tape carrier for mounting a semiconductor chip on a circuit substrate, the bump-attached tape carrier comprising, an insulating film, a conductor pattern formed on the insulating film, and metal bumps formed on the conductor pattern and adapted to be bonded with the semiconductor chip, wherein the metal bumps are respectively formed of a columnar body having a side wall substantially perpendicular to the conductor pattern.
公开/授权文献
- US5328475A Simplified safety syringe with retractable self-biased needle 公开/授权日：1994-07-12