Invention Grant
- Patent Title: Method of forming bumps and template used for forming bumps
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Application No.: US015265Application Date: 1998-01-29
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Publication No.: US6107181APublication Date: 2000-08-22
- Inventor: Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
- Applicant: Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
- Applicant Address: JPX Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JPX Kawasaki
- Priority: JPX9-242879 19970908
- Main IPC: B23K26/10
- IPC: B23K26/10 ; B23K26/38 ; C03C15/00 ; C03C23/00 ; H01L21/60 ; H01L21/68 ; H05K3/00 ; H05K3/34 ; H01L21/44
Abstract:
A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.
Public/Granted literature
- USD356770S Vehicle air deflector Public/Granted day:1995-03-28
Information query
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