发明授权
- 专利标题： Flip-chip connection type semiconductor integrated circuit device
- 专利标题（中）： 倒装芯片连接型半导体集成电路器件
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申请号： US784814申请日： 1997-01-16
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公开(公告)号： US6111317A公开(公告)日： 2000-08-29
- 发明人: Takashi Okada , Naohiko Hirano , Hiroshi Tazawa , Eiichi Hosomi , Chiaki Takubo , Kazuhide Doi , Yoichi Hiruta , Koji Shibasaki
- 申请人： Takashi Okada , Naohiko Hirano , Hiroshi Tazawa , Eiichi Hosomi , Chiaki Takubo , Kazuhide Doi , Yoichi Hiruta , Koji Shibasaki
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX8-006659 19960118
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L23/528 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A first insulating film is formed on an integrated circuit chip on which an I/O pad is formed. A first opening portion is formed above the I/O pad. A conductive layer and a barrier metal layer which are electrically connected to the I/O pad through the first opening portion are stacked on the first insulating film. The conductive layer and the barrier metal layer are patterned by a single mask. A second insulating film is formed on the resultant structure. A second opening portion is formed in the second insulating film at a position different from that of the first opening portion. A solder bump or metal pad is formed on the barrier metal layer in the second opening portion. The position of the solder bump or metal pad is defined by the second opening portion.
公开/授权文献
- USD358237S Automotive adhesive emblem remover 公开/授权日：1995-05-09
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