A wire bonding method comprising the steps of raising a capillary after bonding a ball formed on the tip end of the wire extending from the tip end of a capillary to a first bonding point, moving the capillary to a position located at an upward inclination in the direction of a second bonding point, further moving the capillary to a position located at an upward inclination in the opposite direction from the second bonding point, then moving the capillary to a position located at an upward inclination in the direction of the second bonding point, and then lowering the capillary so that the wire is bonded to the second bonding point by the capillary, thus producing a stable low-height M-shaped wire loop between the first and second bonding point.