发明授权
US6121783A Method and apparatus for establishing electrical contact between a wafer
and a chuck
失效
用于建立晶片和卡盘之间的电接触的方法和装置
- 专利标题： Method and apparatus for establishing electrical contact between a wafer and a chuck
- 专利标题（中）： 用于建立晶片和卡盘之间的电接触的方法和装置
-
申请号： US839217申请日： 1997-04-22
-
公开(公告)号： US6121783A公开(公告)日： 2000-09-19
- 发明人: Gregory S. Horner , Meindert J. Kleefstra , Roger L. Verkuil , Robert A. Miles
- 申请人： Gregory S. Horner , Meindert J. Kleefstra , Roger L. Verkuil , Robert A. Miles
- 专利权人： Horner; Gregory S.,Kleefstra; Meindert J.,Verkuil; Roger L.,Miles; Robert A.
- 当前专利权人： Horner; Gregory S.,Kleefstra; Meindert J.,Verkuil; Roger L.,Miles; Robert A.
- 主分类号： G01R31/28
- IPC分类号： G01R31/28 ; G01R31/312 ; H01L21/66 ; G01R31/02
摘要：
A needle is pressed into the backside oxide of a semiconductor wafer and a voltage applied to the wafer greater than the breakdown voltage of the oxide in order to make an electrical contact with the bulk material of the wafer. A capacitor plate is provided proximate to a wafer on a chuck and a Kelvin probe is provided proximate to the wafer. A varying voltage is applied between the chuck and the capacitor plate and a voltage is monitored between the Kelvin probe and the chuck. The monitored voltage remaining constant indicates electrical contact between the chuck and the wafer.
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