发明授权
- 专利标题： Thermoplastic resin composition and heat-resistant tray for IC
- 专利标题（中）： IC热塑性树脂组合物和耐热托盘
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申请号： US309256申请日： 1999-05-11
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公开(公告)号： US6127492A公开(公告)日： 2000-10-03
- 发明人: Tohru Nagashima , Mituo Maeda , Hiroshi Nakamura
- 申请人： Tohru Nagashima , Mituo Maeda , Hiroshi Nakamura
- 申请人地址： JPX Osaka
- 专利权人： Sumitomo Chemical Company, Limited
- 当前专利权人： Sumitomo Chemical Company, Limited
- 当前专利权人地址： JPX Osaka
- 优先权： JPX10-130200 19980513
- 主分类号： C08K3/04
- IPC分类号： C08K3/04 ; C08K7/06 ; C08L69/00 ; C08L81/06 ; C08F283/02
摘要：
A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The thermoplastic resin composition is excellent in heat-resistance and mechanical strength, and heat-resistant IC trays therefrom are useful products which can endure drying of IC at high temperature and are excellent in handling properties.
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