An adhesive and method for attaching a heat sink to a printing wiring assembly that provides a thermal path from electronic components on the printing wiring assembly to the heat sink. The adhesive is flexible and accommodates thermal expansion stresses and is readily reworkable. The adhesive comprises a filler material that is disposed between the heat sink and the printing wiring assembly, and an impregnant that impregnates the filler material, which impregnated filler material is cured. The filler material may comprise alumina particles that have a spherical shape. The impregnant comprises a polymer, typically selected from a group of epoxy resins and their curatives that form a flexible material when cured. In practicing the method, a heat sink is positioned adjacent to and spaced apart from a printing wiring assembly to provide an appropriate spacing between them. The periphery of the printing wiring assembly is sealed. A cavity that is formed between the heat sink and the printing wiring assembly is filled with a filler material. The filled assembly is vibrated to maximize packing density of the filler material. The filler material is then impregnated with a flexible epoxy impregnant. The impregnant is then cured to form the flexible adhesive. This produces a structure wherein the heat sink is bonded to the printed wiring assembly.