公开(公告)号：US5840829A

公开(公告)日：1998-11-24

申请号：US977031

申请日：1997-11-25

申请人： Ralph D. Hermansen ,  Brian M. Punsly ,  Wai-Cheng Seetoo

发明人： Ralph D. Hermansen ,  Brian M. Punsly ,  Wai-Cheng Seetoo

IPC分类号： C08L63/00 ,  C08L79/04 ,  C09D179/04 ,  C09J163/00 ,  C09J179/04 ,  C08G63/00 ,  C08L67/00 ,  B32B31/00 ,  B31B1/60

CPC分类号： C09D179/04 ,  C09J163/00 ,  C09J179/04 ,  C08L63/00 ,  C08L79/04 ,  Y10T156/10

摘要： An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines. A cyanate ester resin structure assembled with the present adhesive composition may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive and comprehensive metallic coating.

公开(公告)号：US5385966A

公开(公告)日：1995-01-31

申请号：US188667

申请日：1994-01-28

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08L75/04 ,  C08K3/00 ,  C08K9/06 ,  C08L75/00 ,  C09J175/00 ,  C09J175/04 ,  C09J175/14 ,  C09K3/10 ,  C08J3/20 ,  C08K3/26 ,  C08F8/30

CPC分类号： C09K3/1021 ,  C08K3/0033 ,  C08K9/06 ,  C09J175/04 ,  C09J175/14 ,  C09K2003/1071 ,  C09K2200/0213 ,  C09K2200/0243 ,  C09K2200/0247 ,  Y10S525/92

摘要： Adhesives and sealants, based on polyurethane reactants, are provided. The one-component frozen premix material of the invention comprises: (a) up to about 60 vol % of at least one filler; (b) about 0.5 to 5 wt % of a thixotrope comprising hydrophobic fumed silica; and (c) the balance a urethane matrix. The urethane matrix comprises at least one polyol that includes at least one carbon-carbon double bond in its backbone and has less than 20 wt % of ether and ester moieties, at least one aliphatic polyisocyanate in stoichiometric amount relative to the polyol, and about 0.01 to 0.1 wt % of an organo-metallic catalyst. The urethanes of the invention can be stored as one-component, frozen, premix materials for a minimum of three months, and, when thawed, can be applied with a spatula or trowel to form non-sag fillets. The cured elastomers are free of voids, tears, or bubbles.

摘要翻译： 提供基于聚氨酯反应物的粘合剂和密封剂。 本发明的单组分冷冻预混材料包括：（a）至多约60vol％的至少一种填料; （b）约0.5至5重量％的包含疏水性热解法二氧化硅的触变剂; 和（c）氨基甲酸酯基质的平衡。 氨基甲酸酯基质包括至少一种多元醇，其多元醇在其主链中包含至少一个碳 - 碳双键，并且具有少于20重量％的醚和酯部分，至少一种相对于多元醇的化学计量的脂族多异氰酸酯和约0.01 至0.1重量％的有机金属催化剂。 本发明的氨基甲酸酯可以作为单组分的冷冻预混材料储存至少三个月，并且当解冻时，可以用刮刀或t刀施用以形成非下垂的鱼片。 固化的弹性体没有空隙，眼泪或气泡。

公开(公告)号：US4534882A

公开(公告)日：1985-08-13

申请号：US646885

申请日：1984-09-04

申请人： Norman Bilow ,  Ralph D. Hermansen

发明人： Norman Bilow ,  Ralph D. Hermansen

IPC分类号： C08G59/18 ,  C08G59/50

CPC分类号： C08G59/5053 ,  C08G59/184

摘要： A method of making an epoxy prepolymer curing agent is disclosed. The method comprises the steps of reacting a mixture of piperidine and an epoxy resin so as to form an epoxy prepolymer adduct. The adduct is mixed with 2-ethyl-4-methylimidazole thereby forming the curing agent composition.

摘要翻译： 公开了制备环氧预聚物固化剂的方法。 该方法包括使哌啶和环氧树脂的混合物反应以形成环氧预聚物加合物的步骤。 将加合物与2-乙基-4-甲基咪唑混合，从而形成固化剂组合物。

公开(公告)号：US06723803B1

公开(公告)日：2004-04-20

申请号：US08700133

申请日：1996-08-20

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G5940

CPC分类号： C08G59/4035 ,  C08G59/20 ,  C08G59/22 ,  C09J163/00

摘要： Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.

摘要翻译： 在未固化状态下在室温下保持稳定的柔性环氧基粘合剂组合物包含：（a）当化学计量量的二亚乙基三胺固化时，至少一种硬度不超过硬度的肖氏D读数为45的柔性聚环氧树脂（ “DETA”）; 和（b）基本上化学计量的至少一种潜在环氧树脂固化剂。 任选地，粘合剂组合物还可以掺入一种或多种半柔性树脂。 其它任选的组分包括填料，触变剂和增韧剂。 粘合剂组合物提供环氧基粘合剂组合物，其可在室温下作为单一组分混合物储存数周，可在不到两小时内在约100℃至125℃的温度范围内固化，并且在固化至 温度低至零下50摄氏度，表现出肖氏A的硬度小于约95。

公开(公告)号：US6060539A

公开(公告)日：2000-05-09

申请号：US877980

申请日：1997-06-18

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/18 ,  C08G59/20 ,  C08G59/40 ,  C08K3/22 ,  C08K3/34 ,  C08K3/38 ,  C09J163/00 ,  C08K3/28

CPC分类号： C08K3/34 ,  C08G59/184 ,  C08G59/20 ,  C08G59/4035 ,  C08K3/22 ,  C08K3/38 ,  C09J163/00

摘要： A flexible thermally-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) a thermally-conductive filler. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks or even months at room temperature and is curable in less than one hour at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-.degree. F. (0.7 W/m-K).

摘要翻译： 提供柔性导热性环氧系粘合剂组合物及其制造方法。 本发明的粘合剂组合物包含（a）当用化学计量的二亚乙基三胺（“DETA”）固化时，包含至少一种硬度不超过约45的硬度的肖氏D读数的聚环氧树脂的聚合物混合物和基本上化学计量 至少一种潜在环氧树脂固化剂的量; 和（b）导热填料。 可选组分包括二级环氧树脂，非反应性增韧剂，稀释剂和加工助剂。 本粘合剂组合物在室温下流变稳定数周或甚至几个月，并且在约100℃至140℃的温度下在少于1小时内可固化，因此固化的粘合剂组合物显示硬度为肖氏A 小于约90，热导率超过0.4BTU / hr-ft-°F（0.7W / mK）。

公开(公告)号：US5708056A

公开(公告)日：1998-01-13

申请号：US566519

申请日：1995-12-04

申请人： Theresa Renee Lindley ,  Samuel R. Wennberg ,  Henry Morris Sanftleben ,  James M. Rosson ,  Ralph D. Hermansen

发明人： Theresa Renee Lindley ,  Samuel R. Wennberg ,  Henry Morris Sanftleben ,  James M. Rosson ,  Ralph D. Hermansen

IPC分类号： C08G59/18 ,  C08L63/00 ,  H05K3/28 ,  H05K3/34 ,  C08K7/20 ,  C08L63/02 ,  C08L63/04

CPC分类号： C08L63/00 ,  C08G59/18 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/10689 ,  H05K2201/10977 ,  Y02P70/613

摘要： A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enhance the fatigue life of the solder joints. The encapsulation material is a reactive hot melt epoxy that is curable at temperatures significantly lower than that required for previous epoxy-based encapsulation materials. As such, processing of the circuit assembly is greatly facilitated, while the benefit of encapsulated solder joints is achieved for the assembly. The encapsulation material further includes a latent curative and a filler material for lower the coefficient of thermal expansion of the encapsulation material.

摘要翻译： 提供了一种方法和封装材料，用于处理电子电路组件，该电子电路组件具有安装有焊接引线到其衬底的表面贴装集成电路封装，其中焊接引线接头的封装用于增强焊点的疲劳寿命。 封装材料是反应性热熔环氧树脂，其在明显低于以前的环氧基封装材料所需的温度下可固化。 因此，极大地方便了电路组件的处理，同时为组装实现了封装的焊点的益处。 封装材料还包括用于降低封装材料的热膨胀系数的潜在固化剂和填充材料。

公开(公告)号：US5608028A

公开(公告)日：1997-03-04

申请号：US189984

申请日：1994-02-02

申请人： Henry M. Sanftleben ,  Ralph D. Hermansen

发明人： Henry M. Sanftleben ,  Ralph D. Hermansen

IPC分类号： C08G18/40 ,  C08G18/69 ,  C08G59/32 ,  H01B3/30 ,  C08G4/00 ,  C08G59/00

CPC分类号： H01B3/302 ,  C08G18/4045 ,  C08G18/698 ,  C08G59/3218 ,  Y10S528/905

摘要： An adhesive material is provided which is particularly suitable for potting a sensing element within a container. The adhesive material is characterized by mechanical and physical properties which enable the adhesive material to maintain its adhesive and structural integrity under intense thermal cycling conditions, so as to exclude foreign elements from the sensing element when potted within a container with the potting material. The adhesive material can be formulated so as to be sufficiently adherent for use with containers formed from materials such as polybutylene terephthalate, polyethylene terephthalate, and E-coated steel, by including additions of a flexibilized polyol/polyepoxide epoxy novolac in an amount of up to about 15 parts by weight.

摘要翻译： 提供了一种粘合剂材料，其特别适合于将感测元件灌封在容器内。 粘合剂材料的特征在于机械和物理性质，其使得粘合剂材料能够在强烈的热循环条件下保持其粘合剂和结构完整性，以便当将其包封在具有灌封材料的容器内时，将异物从感测元件排除。 粘合剂材料可以被配制成足够的粘附性，以便与诸如聚对苯二甲酸丁二醇酯，聚对苯二甲酸乙二醇酯和E涂层钢等材料形成的容器一起使用，包括添加可挠曲的多元醇/聚环氧化物环氧酚醛清漆，其量可达 约15重量份。

公开(公告)号：US5457165A

公开(公告)日：1995-10-10

申请号：US928885

申请日：1992-08-12

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/22 ,  C08G59/50 ,  C08L63/00 ,  C08L77/06

CPC分类号： C08L63/00 ,  C08G59/226 ,  C08G59/50

摘要： Encapsulant compositions which provide both dry heat and humid heat stability comprise:(a) a first liquid epoxy resin comprising either:(1) the diglycidyl ether of polyoxypropylene glycol; or(2) the diglycidyl ester of linoleic dimer acid;(b) a second liquid epoxy resin comprising the diglycidyl ether of 1,4-butanediol, present in the amount of about 12 to 55 parts by weight of said composition; and(c) a stoichiometric amount of an epoxy resin curing agent selected from the group consisting of a flexibilized polyamine and a flexibilized polyamide.

摘要翻译： 提供干热和湿热稳定性的封装组合物包括：（a）第一液体环氧树脂，其包含：（1）聚氧丙烯二醇的二缩水甘油醚; 或（2）亚油酸二聚酸的二缩水甘油酯; （b）包含1,4-丁二醇的二缩水甘油醚的第二液体环氧树脂，其量为所述组合物的约12至55重量份; 和（c）化学计量的环氧树脂固化剂，其选自柔性聚胺和柔性聚酰胺。

公开(公告)号：US5350779A

公开(公告)日：1994-09-27

申请号：US85244

申请日：1993-06-29

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/50 ,  H01B3/40 ,  C08L63/02

CPC分类号： C08G59/5026 ,  H01B3/40

摘要： Epoxy-type impregnating compounds, which are useful for electrical potting or encapsulation, plastic tooling, and fiber-reinforced composites, comprise a resin component and a stoichiometric amount of a curative and have a curing temperature of less than about 120.degree. F. (49.degree. C.). The resin component is the diglycidyl ether of bisphenol A, either alone or as a mixture with up to about 15 wt % of at least one reactive monoepoxide diluent or up to about 50 wt % of at least one reactive diepoxide diluent, the diluent having a viscosity of less than about 200 cp. The curative is a mixture of cycloaliphatic diamines, comprising from about 20 to 80 wt % of at least one sterically-hindered cycloaliphatic diamine and the balance at least one sterically-unhindered cycloaliphatic diamine. These epoxy compounds are unique because they can be handled in relatively large bulk without concern for dangerous runaway exotherms. In addition, they result in useful products with a moderate service temperature range, without the necessity of high temperature cures. The advantages of the low temperature cure are lower residual stress in the cured product, better dimensional control in molding, and lower energy expenditure.

摘要翻译： 可用于电灌封或封装，塑料加工和纤维增强复合材料的环氧型浸渍化合物包含树脂组分和化学计量量的固化剂，其固化温度低于约120°F。（49 DEG）。 树脂组分是双酚A的二缩水甘油醚，单独或作为与至多约15重量％的至少一种反应性单环氧化物稀释剂或至多约50重量％的至少一种反应性二环氧化物稀释剂的混合物，所述稀释剂具有 粘度小于约200cp。 固化剂是脂环族二胺的混合物，其包含约20至80重量％的至少一个空间位阻环脂族二胺，余量至少一个空间不受阻碍的脂环族二胺。 这些环氧化合物是独特的，因为它们可以在相当大的体积下处理，而不用担心危险的放电放电。 此外，它们产生具有适中的使用温度范围的有用产品，而不需要高温固化。 低温固化的优点是固化产物残留应力较低，成型时尺寸控制更好，能耗更低。

公开(公告)号：US4866108A

公开(公告)日：1989-09-12

申请号：US144909

申请日：1988-01-19

申请人： David J. Vachon ,  Ralph D. Hermansen ,  Steven E. Lau

发明人： David J. Vachon ,  Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/22 ,  C09J163/00 ,  H05K1/02 ,  H05K3/30

CPC分类号： H05K3/305 ,  C08G59/226 ,  C09J163/00 ,  H05K1/0203 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/1443 ,  Y10T428/24967

摘要： A flexible epoxy adhesive composition comprising a mixture of a fatty acid modified epoxy resin and an oxypropylene epoxy resin in the ratio of about 1:3 to 1:1. The adhesive paste also includes a stoichiometric amount of a polyamine curing agent, 1 to 20 total liquid weight percent of a plasticizer and 1 to 5 weight percent of microfine silicon dioxide particles. Fillers, such as aluminum oxide and glass beads, are optionally added. This adhesive paste is particularly well suited for use as a flat pack adhesive to provide a releasable bond and is also well suited for use in space applications.

摘要翻译： 一种柔性环氧粘合剂组合物，其包含脂肪酸改性环氧树脂和氧丙烯环氧树脂的混合物，其比例为约1:3至1:1。 粘合剂糊料还包括化学计量的多胺固化剂，1至20的总液体重量百分比的增塑剂和1至5重量％的微细二氧化硅颗粒。 任选地加入填料，例如氧化铝和玻璃珠。 该粘合剂糊剂特别适合用作扁平包装粘合剂以提供可释放的粘合剂，并且也非常适合用于空间应用。