公开(公告)号：US5929141A

公开(公告)日：1999-07-27

申请号：US901153

申请日：1997-07-28

申请人： Steven E. Lau ,  Deborah S. Huff ,  Ralph D. Hermansen ,  E. Dean Johnston

发明人： Steven E. Lau ,  Deborah S. Huff ,  Ralph D. Hermansen ,  E. Dean Johnston

IPC分类号： C08G59/22 ,  C08G59/50 ,  C09J9/02 ,  C09J163/00 ,  H05K3/32 ,  C08K3/08

CPC分类号： H05K3/321 ,  C08G59/22 ,  C08G59/50 ,  C09J163/00 ,  H05K2201/0133

摘要： A flexible, electrically-conductive, one-component epoxy adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45 when cured with a stoichiometric amount of diethylene triamine; (b) a substantially stoichiometric amount of curing agent including at least one amine-terminated butadiene-acrylonitrile polymer; and (c) an electrically-conductive filler. The epoxy adhesive, upon cure, has a volume resistivity not exceeding about 10.sup.-3 ohm-cm at room temperature and a drop resistance such that a 6-mil-thick (0.015 cm) bond effected by the adhesive can withstand at least six 60-inch (152 cm) drops onto a hard surface. Optional components in the epoxy adhesive include secondary rigid and semi-rigid epoxy resins, secondary amine curing agents, non-reactive flexibilizers, diluents, and processing aids. The adhesive bonds achieved using these epoxy adhesives are non-brittle, flexible, resilient, and drop-resistant, while also exhibiting strong adhesion and good processing characteristics.

摘要翻译： 提供柔性导电的单组分环氧粘合剂组合物及其制备方法。 本发明的粘合剂组合物包含：（a）当化学计量量的二亚乙基三胺固化时，至少一种聚环氧树脂的硬度不超过肖氏D读数约45; （b）基本上化学计量的固化剂，包括至少一种胺封端的丁二烯 - 丙烯腈聚合物; 和（c）导电填料。 环氧树脂粘合剂在固化时的体积电阻率在室温下不超过约10-3欧姆 - 厘米，并且具有防滴落性，使得由粘合剂实现的6密耳厚（0.015cm）的粘合剂能够承受至少六个60 -inch（152厘米）滴在硬表面上。 环氧树脂粘合剂中的任选组分包括二级刚性和半刚性环氧树脂，仲胺固化剂，非反应性增韧剂，稀释剂和加工助剂。 使用这些环氧树脂粘合剂的粘合剂粘合剂是非脆性的，柔性的，有弹性的和防滴落的，同时还具有很强的附着力和良好的加工特性。

公开(公告)号：US6132850A

公开(公告)日：2000-10-17

申请号：US755938

申请日：1996-11-25

申请人： Ralph D. Hermansen ,  Richard F. Davis ,  E. Dean Johnston

发明人： Ralph D. Hermansen ,  Richard F. Davis ,  E. Dean Johnston

IPC分类号： H05K3/00 ,  H05K3/28 ,  B32B5/16

CPC分类号： H05K3/284 ,  H05K3/0058 ,  Y10T428/24893

摘要： An adhesive and method for attaching a heat sink to a printing wiring assembly that provides a thermal path from electronic components on the printing wiring assembly to the heat sink. The adhesive is flexible and accommodates thermal expansion stresses and is readily reworkable. The adhesive comprises a filler material that is disposed between the heat sink and the printing wiring assembly, and an impregnant that impregnates the filler material, which impregnated filler material is cured. The filler material may comprise alumina particles that have a spherical shape. The impregnant comprises a polymer, typically selected from a group of epoxy resins and their curatives that form a flexible material when cured. In practicing the method, a heat sink is positioned adjacent to and spaced apart from a printing wiring assembly to provide an appropriate spacing between them. The periphery of the printing wiring assembly is sealed. A cavity that is formed between the heat sink and the printing wiring assembly is filled with a filler material. The filled assembly is vibrated to maximize packing density of the filler material. The filler material is then impregnated with a flexible epoxy impregnant. The impregnant is then cured to form the flexible adhesive. This produces a structure wherein the heat sink is bonded to the printed wiring assembly.

摘要翻译： 一种用于将散热器附接到印刷布线组件的粘合剂和方法，其提供从打印布线组件上的电子部件到散热器的热路径。 粘合剂是柔性的并且适应热膨胀应力并且易于再加工。 粘合剂包括布置在散热器和印刷布线组件之间的填充材料，以及浸渍填充材料的浸渍剂，浸渍的填充材料被固化。 填充材料可以包括具有球形形状的氧化铝颗粒。 浸渍剂包括通常选自一组环氧树脂及其固化剂的聚合物，其在固化时形成柔性材料。 在实施该方法时，将散热器定位成与印刷布线组件相邻并间隔开以在它们之间提供适当的间隔。 印刷布线组件的周边被密封。 在散热器和印刷布线组件之间形成的空腔填充有填充材料。 填充的组件被振动以最大化填充材料的堆积密度。 然后用柔性环氧浸渍剂浸渍填料。 然后将浸渍剂固化以形成柔性粘合剂。 这产生其中散热器被结合到印刷线路组件的结构。