Invention Grant
- Patent Title: Integrated process for preparation of diene complexes
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Application No.: US420625Application Date: 1999-10-20
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Publication No.: US6136993APublication Date: 2000-10-24
- Inventor: Eugene Y. Chen , Richard E. Campbell, Jr. , David D. Devore , D. Patrick Green , Jasson T. Patton , Jorge Soto , David R. Wilson
- Applicant: Eugene Y. Chen , Richard E. Campbell, Jr. , David D. Devore , D. Patrick Green , Jasson T. Patton , Jorge Soto , David R. Wilson
- Applicant Address: MI Midland
- Assignee: The Dow Chemical Company
- Current Assignee: The Dow Chemical Company
- Current Assignee Address: MI Midland
- Main IPC: C07F7/00
- IPC: C07F7/00 ; C07F7/08 ; C07F9/50 ; C07F17/00 ; C08F4/642 ; C08F4/659 ; C08F4/6592 ; C08F10/00
Abstract:
Disclosed is a process for preparing bridged Group 4 metal complexes containing a neutral diene ligand starting from the corresponding novel, metal diene containing complexes by reaction thereof with the divalent derivative of a bridged bidentate ligand compound. The novel, intermediate metal diene complexes, their formation from tetravalent metal salts and an integrated process combining both process steps are claimed.
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