Invention Grant
- Patent Title: Stepper alignment method and apparatus
- Patent Title (中): 步进对准方法和装置
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Application No.: US236359Application Date: 1999-01-25
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Publication No.: US6139251APublication Date: 2000-10-31
- Inventor: Ron-Fu Chu
- Applicant: Ron-Fu Chu
- Applicant Address: TWX Taoyuan
- Assignee: Nanya Technology Corporation
- Current Assignee: Nanya Technology Corporation
- Current Assignee Address: TWX Taoyuan
- Priority: JPX087117165 19981017
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; B65G47/24
Abstract:
A stepper alignment method and apparatus for transferring circuit layout on a mask to a wafer precisely includes a stepper located in a susceptor and includes a vacuum chuck and a movable vacuum chuck. The wafer has two notches on its perimeter. The vacuum chuck has two sets of photo sensors mating against the notches and a central circular opening for housing the movable vacuum chuck therein. The movable vacuum chuck holds the wafer by means of vacuum force and is able to rotate and move linearly to align the notches of the wafer against the photo sensors accurately at high speed.
Public/Granted literature
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