Invention Grant
US6139385A Method of making a field emission device with silicon-containing
adhesion layer
失效
制造具有含硅粘附层的场致发射器件的方法
- Patent Title: Method of making a field emission device with silicon-containing adhesion layer
- Patent Title (中): 制造具有含硅粘附层的场致发射器件的方法
-
Application No.: US431014Application Date: 1999-11-01
-
Publication No.: US6139385APublication Date: 2000-10-31
- Inventor: Kanwal K. Raina
- Applicant: Kanwal K. Raina
- Applicant Address: ID Boise
- Assignee: Micron Technology Inc.
- Current Assignee: Micron Technology Inc.
- Current Assignee Address: ID Boise
- Main IPC: H01J3/02
- IPC: H01J3/02 ; H01J9/02 ; H01J31/12
Abstract:
A field emission device having a gate electrode structure in which a nanocrystalline or microcrystalline silicon layer is positioned over a silicon dioxide dielectric layer. Also disclosed are methods for forming the field emission device. The nanocrystalline or microcrystalline silicon layer forms a bond with the dielectric layer that is sufficiently strong to prevent delamination during a chemical-mechanical planarization operation that is conducted during formation of the field emission device. The nanocrystalline or microcrystalline silicon layer is deposited by PECVD in an atmosphere that contains silane and hydrogen at a ratio in a range from about 1:15 to about 1:40. Multiple field emission devices may be formed and included in a flat panel display for computer monitors, telecommunications devices, and the like.
Public/Granted literature
- US5647541A Water flow control device for rotary sprinkler Public/Granted day:1997-07-15
Information query