发明授权
US06142773A Enveloping device and vertical heat-treating apparatus for semiconductor
process system
有权
用于半导体工艺系统的包封装置和垂直热处理装置
- 专利标题： Enveloping device and vertical heat-treating apparatus for semiconductor process system
- 专利标题（中）： 用于半导体工艺系统的包封装置和垂直热处理装置
-
申请号： US375466申请日： 1999-08-17
-
公开(公告)号： US06142773A公开(公告)日： 2000-11-07
- 发明人: Tomohisa Shimazu
- 申请人： Tomohisa Shimazu
- 申请人地址： JPX Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX10-232166 19980819
- 主分类号： H01L21/22
- IPC分类号： H01L21/22 ; C23C16/44 ; C23C16/54 ; C30B25/08 ; C30B31/10 ; F27D99/00 ; H01L21/205 ; H01L21/31 ; H01L21/324 ; F27D3/12
摘要：
The process tube of a vertical heat-treating apparatus for semiconductor wafers has a port at the bottom to be opened and closed by a lid. A sealing mechanism is arranged to seal the connecting portion between the flange of the port and the flange of the lid. The flanges are provided with annular mirror surfaces on the inner side, which face and contact each other to form an inner seal. The flanges are also provided with annular counter surfaces on the outer side, which face each other with a gap therebetween. A metal sheet member is arranged in the gap such that an outer seal is formed by the metal sheet member and the counter surfaces. The metal sheet member has sheets vacuum-stuck onto the counter surfaces, respectively. A buffer space is formed between the inner and outer seals, and is vacuum-exhausted by an exhaust unit.
公开/授权文献
- US5672475A Mixed luminescent conjugate test 公开/授权日：1997-09-30
信息查询
IPC分类:
