发明授权
- 专利标题： Method and apparatus for automatically positioning electronic dice with component packages
- 专利标题（中）： 使用组件封装自动定位电子模具的方法和设备
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申请号： US400515申请日： 1999-09-20
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公开(公告)号： US6150828A公开(公告)日： 2000-11-21
- 发明人: Warren M. Farnworth , Alan G. Wood , John O. Jacobson , David R. Hembree , James M. Wark , Jennifer L. Folaron , Robert J. Folaron , Jay C. Nelson , Lelan D. Warren
- 申请人： Warren M. Farnworth , Alan G. Wood , John O. Jacobson , David R. Hembree , James M. Wark , Jennifer L. Folaron , Robert J. Folaron , Jay C. Nelson , Lelan D. Warren
- 申请人地址： ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： ID Boise
- 主分类号： G01R31/26
- IPC分类号： G01R31/26 ; G01R31/28 ; G01R31/311 ; H01L21/00 ; H01L21/60 ; H01L21/66 ; H01L21/68 ; H05K13/08 ; B65G49/07
摘要：
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).
公开/授权文献
- US4496333A Low friction power takeoff shaft 公开/授权日：1985-01-29