发明授权
- 专利标题： Apparatus for and method of transferring substrates
- 专利标题（中）： 用于传送衬底的设备和方法
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申请号： US75927申请日： 1998-05-12
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公开(公告)号： US6152677A公开(公告)日： 2000-11-28
- 发明人: Kiyohisa Tateyama , Hideyuki Takamori
- 申请人： Kiyohisa Tateyama , Hideyuki Takamori
- 申请人地址： JPX Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX9-139143 19970515
- 主分类号： B65G49/07
- IPC分类号： B65G49/07 ; H01L21/677 ; H01L21/683 ; H01L21/687 ; B66C1/00
摘要：
A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.
公开/授权文献
- USD404217S Bed 公开/授权日：1999-01-19
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