发明授权
US6156594A Fabrication of bipolar/CMOS integrated circuits and of a capacitor
失效
双极/ CMOS集成电路和电容器的制造
- 专利标题: Fabrication of bipolar/CMOS integrated circuits and of a capacitor
- 专利标题(中): 双极/ CMOS集成电路和电容器的制造
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申请号: US970070申请日: 1997-11-13
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公开(公告)号: US6156594A公开(公告)日: 2000-12-05
- 发明人: Yvon Gris
- 申请人: Yvon Gris
- 申请人地址: FRX Gentilly
- 专利权人: SGS-Thomson Microelectronics S.A.
- 当前专利权人: SGS-Thomson Microelectronics S.A.
- 当前专利权人地址: FRX Gentilly
- 优先权: FRX9614410 19961119
- 主分类号: H01L21/8249
- IPC分类号: H01L21/8249 ; H01L27/06 ; H01L21/8238
摘要:
The present invention relates to a method for fabricating an integrated circuit including MOS transistors and a bipolar transistor of NPN type, including the steps of: forming the MOS transistors, covering the entire structure with a protection layer, opening the protection layer at the base-emitter location of the bipolar transistor, forming a first P-type doped layer of polysilicon, a second layer of silicon nitride and a second oxide layer, opening these last three layers at the center of the emitter-base region of the bipolar transistor, and depositing a third silicon nitride layer, forming spacers, removing the apparent parts of the third layer of silicon nitride, and depositing a third N-type doped polysilicon layer.
公开/授权文献
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