- 专利标题： Heat treatment method and apparatus using thermal plasma, and heat treated substance produced thereby
-
申请号： US543912申请日： 2000-04-06
-
公开(公告)号： US6156993A公开(公告)日： 2000-12-05
- 发明人: Yoshiaki Inoue , Seiji Yokota , Akira Terajima , Kazuhiro Kawasaki , Masaaki Tamatani , Keiko Albessard , Naotoshi Matsuda , Miwa Okumura , Hirofumi Takemura
- 申请人： Yoshiaki Inoue , Seiji Yokota , Akira Terajima , Kazuhiro Kawasaki , Masaaki Tamatani , Keiko Albessard , Naotoshi Matsuda , Miwa Okumura , Hirofumi Takemura
- 申请人地址： JPX Tokyo JPX Kanagawa-ken
- 专利权人： Neturen Co., Ltd.,Toshiba Corporation
- 当前专利权人： Neturen Co., Ltd.,Toshiba Corporation
- 当前专利权人地址： JPX Tokyo JPX Kanagawa-ken
- 优先权： JPX8-356659 19961227; JPX8-635652 19961227
- 主分类号： B23K9/00
- IPC分类号： B23K9/00 ; B23K10/00
摘要：
In the method, apparatus and the substance produced thereby: a plasma flame 1 is produced by a plasma torch 11; the plasma flame 1 is passed through a plasma flame furnace 21 which controls the heat of the plasma flame 1; then, the plasma flame 1 is injected into a reactor column 31 to heat the substance. The substance may be a particle. The plasma flame 1 has a wide flame area in which a temperature of flame is uniform.
公开/授权文献
信息查询
