发明授权
- 专利标题: End effector for pad conditioning
- 专利标题(中): 末端执行器用于垫调节
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申请号: US241910申请日: 1999-02-02
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公开(公告)号: US6159087A公开(公告)日: 2000-12-12
- 发明人: Manoocher Birang , John Prince
- 申请人: Manoocher Birang , John Prince
- 申请人地址: CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: CA Santa Clara
- 主分类号: B24B53/007
- IPC分类号: B24B53/007 ; B24B53/017 ; B24D3/28 ; B24D11/00 ; B24B1/00
摘要:
An end effector is provided for conditioning pads used to polish semiconductor wafers. The end effector has a substrate with a matrix (preferably a polymer) disposed thereon. Abrasive particles such as diamond crystals are embedded in the matrix. Preferred particle size and number/spacing is provided for optimal conditioning. The particles are embedded by at least a predetermined amount (e.g., 75%) so as to provide uniform/repeatable conditioning while avoiding dislodged particles. The particles may be embedded such that the tips thereof are coplanar, or such that the profile of diamond tips form a plurality of curved regions. A method for checking end effector quality is also provided.
公开/授权文献
- US5539895A Hierarchical computer cache system 公开/授权日:1996-07-23