公开(公告)号：US06390904B1

公开(公告)日：2002-05-21

申请号：US09082891

申请日：1998-05-21

申请人： Allan Gleason ,  Manoocher Birang ,  John Prince ,  Mohsen Salek ,  Syed Askari

发明人： Allan Gleason ,  Manoocher Birang ,  John Prince ,  Mohsen Salek ,  Syed Askari

IPC分类号： B24B500

CPC分类号： B24B37/32 ,  H01L21/30625

摘要： The present invention provides a retaining ring having an resilient liner for protecting the substrate edge from being damaged during chemical mechanical polishing and a method for making the same. Retainers made of wear resistant ceramics, such as alumina, provide better overall performance, including wear resistance, and reduced particle formation than other retaining ring materials. By incorporating a resilient liner, such as an epoxy, on the inner surface of the wear resistant ring, the substrate edge is protected from damage that can be easily caused by the hard surface of the ceramic alone.

摘要翻译： 本发明提供了一种保持环，其具有用于保护基板边缘在化学机械抛光期间不被损坏的弹性衬垫及其制造方法。 由耐磨陶瓷制成的保持件，如氧化铝，提供比其他保持环材料更好的整体性能，包括耐磨性和减少的颗粒形成。 通过在耐磨环的内表面上并入弹性衬垫，例如环氧树脂，可以保护衬底边缘免受仅由陶瓷硬表面容易引起的损伤。

公开(公告)号：US6159087A

公开(公告)日：2000-12-12

申请号：US241910

申请日：1999-02-02

申请人： Manoocher Birang ,  John Prince

发明人： Manoocher Birang ,  John Prince

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24D3/28 ,  B24D11/00 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24D11/001 ,  B24D3/28

摘要： An end effector is provided for conditioning pads used to polish semiconductor wafers. The end effector has a substrate with a matrix (preferably a polymer) disposed thereon. Abrasive particles such as diamond crystals are embedded in the matrix. Preferred particle size and number/spacing is provided for optimal conditioning. The particles are embedded by at least a predetermined amount (e.g., 75%) so as to provide uniform/repeatable conditioning while avoiding dislodged particles. The particles may be embedded such that the tips thereof are coplanar, or such that the profile of diamond tips form a plurality of curved regions. A method for checking end effector quality is also provided.

摘要翻译： 提供端部执行器用于调整用于抛光半导体晶片的衬垫。 末端执行器具有设置在其上的基体（优选聚合物）的基底。 磨料颗粒如金刚石晶体嵌入基质中。 提供优选的粒度和数量/间距用于最佳调理。 颗粒被嵌入至少预定量（例如75％），以便提供均匀/可重复的调理，同时避免脱落的颗粒。 颗粒可以被嵌入，使得其尖端是共面的，或者使得金刚石尖端的轮廓形成多个弯曲区域。 还提供了一种用于检查末端执行器质量的方法。

公开(公告)号：US5989103A

公开(公告)日：1999-11-23

申请号：US933815

申请日：1997-09-19

申请人： Manoocher Birang ,  John Prince ,  James Nystrom

发明人： Manoocher Birang ,  John Prince ,  James Nystrom

IPC分类号： B23Q3/154 ,  B24B41/06 ,  B24B1/00

CPC分类号： B24B37/30 ,  B23Q3/1546 ,  B24B41/068

摘要： A carrier head assembly including a drive shaft and a system flange connectable to the drive shaft where the system flange includes a number of magnetic plates. The carrier head assembly also includes a carrier head flange. The carrier head flange has more magnetic plates, these magnetic plates generally facing the previous plates. The magnetic plates magnetically engage to couple the carrier head flange to the system flange.

摘要翻译： 一种载体头组件，其包括驱动轴和连接到驱动轴的系统凸缘，其中系统凸缘包括多个磁性板。 承载头组件还包括承载头凸缘。 载体头法兰具有更多的磁性板，这些磁性板通常面向以前的板。 磁性板磁性接合以将承载头凸缘与系统凸缘相连接。

公开(公告)号：US5938507A

公开(公告)日：1999-08-17

申请号：US549480

申请日：1995-10-27

申请人： Sen-Hou Ko ,  Richard V. Rafloski ,  James C. Nystrom ,  John Prince ,  Alfred A. Goldspiel ,  Stephen J. Blumenkranz ,  Manoocher Birang

发明人： Sen-Hou Ko ,  Richard V. Rafloski ,  James C. Nystrom ,  John Prince ,  Alfred A. Goldspiel ,  Stephen J. Blumenkranz ,  Manoocher Birang

IPC分类号： B24B53/017 ,  H01L21/304 ,  B24B21/18

CPC分类号： B24B53/017

摘要： A conditioner apparatus uses one or more linear conditioners. The linear conditioners extend from the edge of the polishing pad almost to the center of the pad. The conditioner apparatus may use two conditioner rods located on either side of a radial segment. The rods gimbal so that if one rod rises, the other rod is forced downwardly. In addition, the rods can pivot independently about a lateral axis, but they cannot pivot around the vertical axis. The linear conditioners may be actuated by a piezoelectric member or swept by an arm toward and away from the center of the polishing pad.

摘要翻译： 调节装置使用一个或多个线性调节器。 线性调节器从抛光垫的边缘几乎延伸到垫的中心。 调理装置可以使用位于径向段两侧的两个调节杆。 杆状万向节，如果一根杆上升，另一根杆被迫向下。 此外，杆可以围绕横向轴线独立地枢转，但是它们不能围绕垂直轴线枢转。 线性调节器可以由压电元件驱动，或者由臂朝着抛光垫的中心或远离抛光垫的中心扫动。

公开(公告)号：US5743784A

公开(公告)日：1998-04-28

申请号：US574501

申请日：1995-12-19

申请人： Manoocher Birang ,  John Prince

发明人： Manoocher Birang ,  John Prince

IPC分类号： B24B53/00 ,  B24B37/013 ,  B24B49/02 ,  B24B7/22 ,  B24B53/02

CPC分类号： B24B37/013 ,  B24B49/02

摘要： An apparatus and method for detecting the roughness of a CMP pad surface, in situ, during pad conditioning by measuring and making use of surface friction effects. The effect is advantageously exploited to determine an endpoint for the pad conditioning process i.e. when the surface roughness of the pad is within a desired range, to facilitate the qualification of conditioning process parameter changes by determining their effect on the conditioning process, and to optimize these parameters. Also, the effect is employed to measure non-uniformities in the pad's surface roughness, and to guide corrective measures. Generally, these objectives are accomplished using an apparatus which includes a floating head having its bottom surface in contact with the top surface of a rotating CMP pad undergoing a CMP pad conditioning process. A bracket is employed to restrain the floating head so as to prevent the head from moving along with the rotating CMP pad. A force sensing device is used to sense a restraining force exerted by the bracket on the floating head and to output a signal indicative of the restraining force. This restraining force is indicative of the friction between the floating head and the pad, and can be used to determine the coefficient of friction. The coefficient of friction is directly related to the surface roughness of the pad.

摘要翻译： 一种用于通过测量和利用表面摩擦效应在衬垫调节期间原位检测CMP焊盘表面的粗糙度的装置和方法。 有利地利用该效果来确定衬垫调节过程的端点，即当衬垫的表面粗糙度在期望的范围内时，以便于通过确定其对调理过程的影响来调节过程参数变化的限定，并优化这些 参数。 此外，该效果用于测量垫表面粗糙度中的不均匀性，并指导纠正措施。 通常，这些目的是使用包括浮动头的装置来实现的，该浮动头的底面与经历CMP垫调节过程的旋转CMP垫的顶表面相接触。 采用支架来限制浮动头，以防止头部与旋转的CMP垫一起移动。 力感测装置用于感测由支架施加在浮动头上的约束力并输出指示约束力的信号。 该约束力表示浮动头和垫之间的摩擦，并且可用于确定摩擦系数。 摩擦系数与垫的表面粗糙度直接相关。

公开(公告)号：US07775852B2

公开(公告)日：2010-08-17

申请号：US11099789

申请日：2005-04-05

申请人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

发明人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

IPC分类号： B24B49/12

CPC分类号： H01L22/12 ,  B24B37/013 ,  B24B37/205 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683

摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

摘要翻译： 使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。 该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。 该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

公开(公告)号：US07731566B2

公开(公告)日：2010-06-08

申请号：US11838808

申请日：2007-08-14

申请人： Manoocher Birang ,  Grigory Pyatigorsky

发明人： Manoocher Birang ,  Grigory Pyatigorsky

IPC分类号： B24B49/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/06 ,  G01B11/0683

摘要： A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.

摘要翻译： 抛光衬底的方法包括：将抛光垫保持在具有抛光头的抛光垫上，其中抛光垫由压板支撑，在衬底和抛光垫之间产生相对运动以抛光衬底的侧面，产生光 光束并将光束引向基板，以使光束撞击正在抛光的基板的侧面。 从基板反射的光在检测器处产生干涉信号。 从干扰信号计算均匀度的度量。

公开(公告)号：US07727364B2

公开(公告)日：2010-06-01

申请号：US11362432

申请日：2006-02-24

申请人： Saravjeet Singh ,  Hooman Hafezi ,  Manoocher Birang ,  Aron Rosenfeld ,  Joseph Behnke

发明人： Saravjeet Singh ,  Hooman Hafezi ,  Manoocher Birang ,  Aron Rosenfeld ,  Joseph Behnke

IPC分类号： C25D17/12 ,  C25D7/12

CPC分类号： C25D17/10 ,  C25D5/04 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/02 ,  H01L21/2885

摘要： A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.

摘要翻译： 一种用于将金属电镀到基底上的方法和装置。 本发明的一个实施例提供了一种用于对基底进行电化学电镀的装置。 该装置包括被配置为在其中保持电镀溶液的流体池，设置在流体池中的阳极组件，被配置为支撑基板并电连接基板的基板支撑构件以及设置在流体池中的封装辅助电极组件。 包封的辅助电极组件通常包括设置在保护管中的辅助电极。

公开(公告)号：US20100050779A1

公开(公告)日：2010-03-04

申请号：US12201242

申请日：2008-08-29

申请人： Victor L. Pushparaj ,  Omkaram Nalamasu ,  Manoocher Birang

发明人： Victor L. Pushparaj ,  Omkaram Nalamasu ,  Manoocher Birang

IPC分类号： G01B7/16 ,  H01L49/00 ,  H01L21/66

CPC分类号： G01L1/20 ,  G01L1/18 ,  G01L5/0076 ,  Y10S977/953 ,  Y10S977/956

摘要： A robust, stand-alone load cell comprises a block of aligned carbon nanotubes with parallel electrodes on opposing sides of the block and an electrical circuit connected between the electrodes for measuring the electrical resistance of the block. The nanotubes are preferably aligned perpendicular to the electrodes. Carbon nanotube-based load cells may be incorporated into a wafer asssembly for characterizing semiconductor processing equipment. Such a wafer assembly includes two parallel wafers with a plurality of carbon nanotube load cells positioned between and attached to both wafers. The load cells are independently electrically connected to a device which monitors and records the resistivity of the load cell. According to further aspects of the invention, each of the load cell's parallel electrodes may be comprised of many small electrodes, where each small electrode on one side of the block has a corresponding small electrode on the opposing side of the block; corresponding pairs of small electrodes are connected in series to form a chain; an electrical circuit, connected to both ends of the chain of opposing pairs of electrodes, is used to measure the electrical resistance of the chain.

摘要翻译： 坚固的独立测力传感器包括在块的相对侧上具有平行电极的对准碳纳米管块和连接在电极之间的用于测量块的电阻的电路。 纳米管优选垂直于电极取向。 可以将碳纳米管基称重传感器结合到用于表征半导体处理设备的晶片组件中。 这种晶片组件包括两个平行的晶片，其中多个碳纳米管负载单元位于两个晶片之间并附着在两个晶片上。 称重传感器独立地电连接到监测和记录称重传感器的电阻率的装置。 根据本发明的另外的方面，每个负载传感器的平行电极可以由许多小电极组成，其中块的一侧上的每个小电极在块的相对侧具有相应的小电极; 相应的一对小电极串联连接形成链条; 连接到相对电极对的链的两端的电路用于测量链的电阻。

公开(公告)号：US07500901B2

公开(公告)日：2009-03-10

申请号：US11222561

申请日：2005-09-08

申请人： Boguslaw A. Swedek ,  Nils Johansson ,  Manoocher Birang

发明人： Boguslaw A. Swedek ,  Nils Johansson ,  Manoocher Birang

IPC分类号： B24B49/00 ,  B24B51/00

CPC分类号： B24B37/013 ,  B24B49/10

摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.

摘要翻译： 实施用于监测抛光衬底的技术的方法和装置。 获取两个或多个数据点，其中每个数据点具有受传感器感测区域内的特征影响的值，并且对应于感测区域穿过衬底的衬底和传感器的相对位置。 一组参考点用于修改采集的数据点。 该修改补偿由穿过衬底的感测区域引起的所获取的数据点中的失真。 基于修改的数据点，评估基板的局部特性以监测抛光。