发明授权
- 专利标题： Buffer layers on metal surfaces having biaxial texture as superconductor substrates
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申请号： US174188申请日： 1998-10-16
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公开(公告)号： US6159610A公开(公告)日： 2000-12-12
- 发明人: Mariappan Paranthaman , Dominic F. Lee , Donald M. Kroeger , Amit Goyal
- 申请人： Mariappan Paranthaman , Dominic F. Lee , Donald M. Kroeger , Amit Goyal
- 申请人地址： TN Oak Ridge
- 专利权人： UT-Battelle, LLC
- 当前专利权人： UT-Battelle, LLC
- 当前专利权人地址： TN Oak Ridge
- 主分类号： C23C14/08
- IPC分类号： C23C14/08 ; C30B23/02 ; H01L39/24 ; B32B9/00
摘要：
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /Ni, (RE=Rare Earth), RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /CeO.sub.2 /Ni, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /CeO.sub.2 /Cu, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approaches, which include chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.
公开/授权文献
- US4343922A Polymers containing chemically bonded metal atoms 公开/授权日：1982-08-10
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