发明授权
- 专利标题： Flip chip pre-assembly underfill process
- 专利标题（中）： 倒装芯片预组装底部填充工艺
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申请号： US09218781申请日： 1998-12-22
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公开(公告)号： US06168972A公开(公告)日： 2001-01-02
- 发明人: Wen-chou Vincent Wang , Michael G. Peters , Dashun S. Zhou , Yasuhito Takahashi
- 申请人： Wen-chou Vincent Wang , Michael G. Peters , Dashun S. Zhou , Yasuhito Takahashi
- 主分类号： H01L2148
- IPC分类号： H01L2148
摘要：
An encapsulation process for flip-chip bonding chips to a substrate encapsulates solder balls on the chip in a separate encapsulation process in which the chip is coated with encapsulation layer and then a portion of the encapsulation layer is removed to expose a portion of the solder balls.
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