Invention Grant
- Patent Title: Semiconductor device manufacturing method, manufacturing apparatus, simulation method and simulator
- Patent Title (中): 半导体器件制造方法,制造装置,仿真方法和仿真器
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Application No.: US08777189Application Date: 1996-12-27
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Publication No.: US06185472B2Publication Date: 2001-02-06
- Inventor: Shinji Onga , Takako Okada , Hiroshi Tomita , Kikuo Yamabe , Haruo Okano
- Applicant: Shinji Onga , Takako Okada , Hiroshi Tomita , Kikuo Yamabe , Haruo Okano
- Priority: JP7-352154 19951228; JP8-124126 19960325
- Main IPC: G06F1900
- IPC: G06F1900

Abstract:
A semiconductor device manufacturing method capable of proceeding semiconductor device manufacturing processes according to predetermined schedules or while correcting them without testpieces is provided. The method includes the steps of collecting actually observed data during at least one of plural steps, obtaining prediction data in at least one of plural steps by using an ab initio molecular dynamics process simulator or a molecular dynamics simulator, comparing and verifying the prediction data and the actually observed data sequentially at real time, and correcting and processing the plural manufacturing process factors sequentially at real time if a difference in significance is recognized between set values for the plural manufacturing process factors and the plural manufacturing process factors estimated from the actually observed data according to comparison and verification.
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