发明授权
- 专利标题: Complementary heterostructure integrated single metal transistor fabrication method
- 专利标题(中): 互补异质结构集成单金属晶体管制造方法
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申请号: US09059890申请日: 1998-04-14
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公开(公告)号: US06198116B1公开(公告)日: 2001-03-06
- 发明人: Charles L. A. Cerny , Christopher A. Bozada , Gregory C. DeSalvo , John L. Ebel , Ross W. Dettmer , James K. Gillespie , Charles K. Havasy , Thomas J. Jenkins , Kenichi Nakano , Carl I. Pettiford , Tony K. Quach , James S. Sewell , G. David Via
- 申请人: Charles L. A. Cerny , Christopher A. Bozada , Gregory C. DeSalvo , John L. Ebel , Ross W. Dettmer , James K. Gillespie , Charles K. Havasy , Thomas J. Jenkins , Kenichi Nakano , Carl I. Pettiford , Tony K. Quach , James S. Sewell , G. David Via
- 主分类号: H01L29778
- IPC分类号: H01L29778
摘要:
A method for fabricating a periodic table group III-IV metal semiconductor metal field-effect enhancement mode complementary transistor pair device is described, a device typically made of gallium arsenide materials. The disclosed fabrication uses initially undoped semiconductor materials, single metallization for ohmic and Schottky barrier contacts, employs a non-alloyed ohmic contact semiconductor layer and includes an inorganic dielectric material layer providing non photosensitive masking at plural points in the fabrication sequence. The invention uses selective ion implantations, and a combined optical and electron beam lithographic process, the latter in small dimension gate areas. These attributes are combined to provide a field-effect transistor complementary pair of reduced fabrication cost, low electrical energy operating requirements increased dimensional accuracy and current state of the art electrical performance. Fabricated device characteristics are also disclosed.
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