摘要:
A method for fabricating a periodic table group III-IV metal semiconductor metal field-effect enhancement mode complementary transistor pair device is described, a device typically made of gallium arsenide materials. The disclosed fabrication uses initially undoped semiconductor materials, single metallization for ohmic and Schottky barrier contacts, employs a non-alloyed ohmic contact semiconductor layer and includes an inorganic dielectric material layer providing non photosensitive masking at plural points in the fabrication sequence. The invention uses selective ion implantations, and a combined optical and electron beam lithographic process, the latter in small dimension gate areas. These attributes are combined to provide a field-effect transistor complementary pair of reduced fabrication cost, low electrical energy operating requirements increased dimensional accuracy and current state of the art electrical performance. Fabricated device characteristics are also disclosed.
摘要:
An enhancement mode periodic table group III-IV semiconductor field-effect transistor device is disclosed. The disclosed transistor includes single metallization for ohmic and Schottky barrier contacts, a permanent non photosensitive passivation layer (a layer which has also been used for masking purposes during fabrication of the transistor) and a gate element of small dimension and shaped cross section as needed to provide desirable microwave spectrum electrical characteristics. The transistor of the invention is fabricated from undoped semiconductor materials disposed in a layered wafer structure and selectively doped by ion implantation to achieve either a p-channel or an n-channel transistor. The semiconductor materials may include two, one or zero buffer layers in their layer structure. The disclosed transistor is of reduced fabrication cost, increased dimensional accuracy and state of the art electrical performance.
摘要:
An enhancement mode periodic table group III-IV semiconductor field-effect transistor complementary pair device is disclosed. The disclosed complementary pair include single metallization for ohmic and Schottky barrier contacts, a permanent non photosensitive passivation layer (a layer which has also been used for masking purposes during fabrication of the device) and gate elements of small dimension and shaped cross section to provide desirable microwave spectrum electrical characteristics. The complementary pair of the invention is fabricated from undoped semiconductor materials disposed in a layered wafer structure and selectively doped by ion implantation to achieve both the p-channel and n-channel transistors. The semiconductor materials may include two, one or zero buffer layers in their layer structure. The disclosed complementary pair is of reduced fabrication cost, increased dimensional accuracy and state of the art electrical performance.
摘要:
A method for fabricating an enhancement mode periodic table group III-IV metal semiconductor metal field-effect transistor is described. The disclosed fabrication arrangement uses single metallization for ohmic and Schottky barrier contacts, employs initially undoped semiconductor materials--materials selectively doped in a disclosed processing step, employs a non-alloyed ohmic contact semiconductor layer and includes an inorganic dielectric material layer providing non photosensitive masking at plural points in the fabrication sequence along with permanent surface passivation. The invention uses a combined optical and electron beam lithographic process, the latter in small dimension gate areas. These attributes are combined to provide a field-effect transistor capable of microwave frequency use, of reduced fabrication cost, low electrical energy operating requirements increased dimensional accuracy and state of the art electrical performance. Fabricated device characteristics are also disclosed.