发明授权
- 专利标题： Method of production of semiconductor device
- 专利标题（中）： 半导体器件的生产方法
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申请号： US08981509申请日： 1998-07-30
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公开(公告)号： US06223429B1公开(公告)日： 2001-05-01
- 发明人: Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
- 申请人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
- 优先权： JP7-146363 19950613; JP7-340096 19951227
- 主分类号： H05K330
- IPC分类号： H05K330
摘要：
To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.
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