公开(公告)号：US06223429B1

公开(公告)日：2001-05-01

申请号：US08981509

申请日：1998-07-30

申请人： Aizou Kaneda ,  Masaaki Yasuda ,  Itsuo Watanabe ,  Tomohisa Ohta ,  Fumio Inoue ,  Yoshiaki Tsubomatsu ,  Toshio Yamazaki ,  Hiroto Ohata ,  Kenzo Takemura ,  Akira Nagai ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

发明人： Aizou Kaneda ,  Masaaki Yasuda ,  Itsuo Watanabe ,  Tomohisa Ohta ,  Fumio Inoue ,  Yoshiaki Tsubomatsu ,  Toshio Yamazaki ,  Hiroto Ohata ,  Kenzo Takemura ,  Akira Nagai ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/32 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29384 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.

摘要翻译： 为了提供高可靠性的半导体器件结构，其能够降低封装的生产成本，包括芯片的成本，并且即使在长期耐环境测试的条件下也可能导致连接电阻的变化较小。在包括 面向下接合到布线板的半导体芯片，其结构是在相对的布线板端子处设置突出的金属部分，而不在芯片的焊盘上形成凸块，整个芯片表面用有机的各向异性导电 粘合剂材料，并且芯片的背面的整个或至少一个边缘被密封材料覆盖。

公开(公告)号：US06338195B1

公开(公告)日：2002-01-15

申请号：US09472026

申请日：1999-12-27

申请人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

摘要翻译： 通过将连接片插入电极之间，将彼此面对的电极牢固地接合在一起的连接片。 连接片包括含有绝缘性的第一粘合剂的第一粘合剂层和包含具有绝缘性的第二粘合剂和导电材料的第二粘合剂层，并且至少放置在第一粘合剂层的一侧。 在电极连接的同时，熔融时的第二粘合剂的粘度等于或低于第一粘合剂的粘度。 当电极与该结构连接时，包含在第二粘合剂层中的导电材料被嵌入具有相对较高熔融粘度的第一粘合剂层中，并且部分导电材料被捕​​获在与其连接的电极上。 因此，导电材料可以牢固地保持在电极之间。 此外，由于相邻的突出电极之间的区域不含气泡，因此确保了连接可靠性和优异的耐湿性。

公开(公告)号：US6034331A

公开(公告)日：2000-03-07

申请号：US681397

申请日：1996-07-23

申请人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： H01L21/60 ,  H05K3/32 ,  H05K1/16

CPC分类号： H01L24/83 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/0224 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

摘要翻译： 通过将连接片插入电极之间，将彼此面对的电极牢固地接合在一起的连接片。 连接片包括含有绝缘性的第一粘合剂的第一粘合剂层和位于第一粘合剂层的至少一侧并且包含具有绝缘性的第二粘合剂和导电材料的第二粘合剂层，其中在此时 的第二粘合剂熔融时的粘度等于或低于第一粘合剂熔融时的粘度。 当电极与该结构连接时，包含在第二粘合剂层中的导电材料被嵌入具有相对较高熔融粘度的第一粘合剂层中，并且部分导电材料被捕​​获在与其连接的电极上。 因此，导电材料可以牢固地保持在电极之间。 此外，由于相邻的突出电极之间的区域不含气泡，因此确保了连接可靠性和优异的耐湿性。

公开(公告)号：US20080219427A1

公开(公告)日：2008-09-11

申请号：US12044794

申请日：2008-03-07

申请人： Norihiko NAONO ,  Tomohisa Ohta

发明人： Norihiko NAONO ,  Tomohisa Ohta

IPC分类号： H04M3/42

CPC分类号： H04M3/42374 ,  H04L65/1059 ,  H04M1/27455

摘要： An information terminal includes a microprocessor for gathering a plurality of information sets of a user, with the user being a communication partner, and the information set including an identification tag for specifying the communication partner, communication service information corresponding to a specific communication service among a plurality of communication services and contact information of the communication partner, and a storage device for storing the plurality of information sets.

摘要翻译： 信息终端包括用于收集用户的多个信息集的微处理器，用户是通信伙伴，并且所述信息集包括用于指定通信伙伴的识别标签，对应于特定通信服务的通信服务信息 多个通信服务和通信对方的联系信息，以及用于存储多个信息集的存储装置。

公开(公告)号：US5723253A

公开(公告)日：1998-03-03

申请号：US567101

申请日：1995-12-04

申请人： Katuhiko Higashino ,  Tomohisa Ohta ,  Shinichi Matsubara

发明人： Katuhiko Higashino ,  Tomohisa Ohta ,  Shinichi Matsubara

IPC分类号： G03F7/023

CPC分类号： G03F7/0233

摘要： Disclosed is a light-sensitive composition containing an o-quinonediazide compound, a novolak resin and a polymer, characterized in that the polymer contains a constitutional unit selected from the group consisting of constitutional units represented by the formulae (I), (II) and (III): ##STR1## wherein R.sup.1 to R.sup.12 each represent a hydrogen atom, an alkyl group or a phenyl group, and a lithographic printing plate using the same.

摘要翻译： 公开了含有邻醌二叠氮化合物，酚醛清漆树脂和聚合物的感光性组合物，其特征在于，所述聚合物含有选自由式（I），（II）和（II）表示的结构单元和 （III）：其中R 1至R 12各自表示氢原子，烷基或苯基，和使用其的平版印刷版。

公开(公告)号：US07009774B2

公开(公告)日：2006-03-07

申请号：US10950511

申请日：2004-09-28

申请人： Takehisa Yoshikawa ,  Yukio Maeda ,  Masato Taya ,  Tomohisa Ohta ,  Isao Ishizawa ,  Makoto Satoh

发明人： Takehisa Yoshikawa ,  Yukio Maeda ,  Masato Taya ,  Tomohisa Ohta ,  Isao Ishizawa ,  Makoto Satoh

IPC分类号： G02B27/10 ,  B29D11/00

CPC分类号： G02B5/201 ,  G02B3/0025 ,  G02B3/0031 ,  G02B3/0043 ,  G02B3/0056 ,  G02B5/021 ,  G02B5/0268 ,  G02B5/0284 ,  G02F1/133553 ,  G02F2203/03

摘要： A component including a part having a concave and convex configuration for one of the enabling one of light convergence, light diffusion and light diffraction, being formed as a reflective film. The outline of the concave and convex configuration viewed from a right angle relative to a horizontal face has a half moon-shape, and a direction of a straight line part of the half moon-shape of each concave and convex configuration matches a direction of the horizontal face, and a plurality of the concave and convex configurations are combined.

摘要翻译： 作为反射膜，形成具有用于光聚光，光扩散和光衍射之一的凹凸结构的部件的部件。 从直角相对于水平面观察的凹凸构造的轮廓为半月形，并且每个凹凸构造的半月形的直线部分的方向与 水平面，多个凹凸构造组合。

公开(公告)号：US20050041295A1

公开(公告)日：2005-02-24

申请号：US10950511

申请日：2004-09-28

申请人： Takehisa Yoshikawa ,  Yukio Maeda ,  Masato Taya ,  Tomohisa Ohta ,  Isao Ishizawa ,  Makoto Satoh

发明人： Takehisa Yoshikawa ,  Yukio Maeda ,  Masato Taya ,  Tomohisa Ohta ,  Isao Ishizawa ,  Makoto Satoh

IPC分类号： G02F1/1335 ,  B29C39/12 ,  B29C39/26 ,  B29L11/00 ,  G02B3/00 ,  G02B6/26 ,  G02B6/42 ,  G02B27/10

CPC分类号： G02B5/201 ,  G02B3/0025 ,  G02B3/0031 ,  G02B3/0043 ,  G02B3/0056 ,  G02B5/021 ,  G02B5/0268 ,  G02B5/0284 ,  G02F1/133553 ,  G02F2203/03

摘要： A component including a part having a concave and convex configuration for one of the enabling one of light convergence, light diffusion and light diffraction, being formed as a reflective film. The outline of the concave and convex configuration viewed from a right angle relative to a horizontal face has a half moon-shape, and a direction of a straight line part of the half moon-shape of each concave and convex configuration matches a direction of the horizontal face, and a plurality of the concave and convex configurations are combined.

摘要翻译： 作为反射膜，形成具有用于光聚光，光扩散和光衍射之一的凹凸结构的部件的部件。 从直角相对于水平面观察的凹凸构造的轮廓为半月形，并且每个凹凸构造的半月形的直线部分的方向与 水平面，多个凹凸构造组合。

公开(公告)号：US4659788A

公开(公告)日：1987-04-21

申请号：US718290

申请日：1985-04-01

申请人： Tomohisa Ohta ,  Akihiko Dobashi ,  Hisashige Kanbara ,  Yasuyuki Seki

发明人： Tomohisa Ohta ,  Akihiko Dobashi ,  Hisashige Kanbara ,  Yasuyuki Seki

IPC分类号： C08F2/46 ,  C08F2/54 ,  C08F290/00 ,  C08F290/12 ,  C08F299/00 ,  C08L61/32 ,  C09J4/00 ,  C09J133/06 ,  C09J155/00 ,  C08L61/28

CPC分类号： C08F290/12 ,  C09J133/06 ,  C08L61/32 ,  Y10S525/91 ,  Y10S525/92 ,  Y10S525/921

摘要： A radiation curable adhesive composition comprising a liquid oligomer, a chain transfer agent, and an N-methyl compound can give a surface protective film which is slightly influenced in adhesive strength with the lapse of time, and excellent in weather resistance and heat resistance.

摘要翻译： 包含液体低聚物，链转移剂和N-甲基化合物的可辐射固化粘合剂组合物可以产生随时间流逝粘合强度轻微影响的表面保护膜，耐候性和耐热性优异。

公开(公告)号：US4554174A

公开(公告)日：1985-11-19

申请号：US678046

申请日：1984-12-04

申请人： Tomohisa Ohta ,  Akihiko Dobashi ,  Hisashige Kanbara ,  Yasuyuki Seki

发明人： Tomohisa Ohta ,  Akihiko Dobashi ,  Hisashige Kanbara ,  Yasuyuki Seki

IPC分类号： C08G75/00 ,  C08G75/02 ,  C08G75/04 ,  C08J7/06 ,  C09J7/02 ,  B05D3/06

CPC分类号： C09J7/0246 ,  C08J7/065 ,  C09J7/0257

摘要： In a process for producing a radiation curable pressure sensitive adhesive tape, when a quaternary ammonium salt is coated on a substrate as an undercoating before the coating of an adhesive composition comprising a liquid oligomer and a thiol compound, the resulting adhesive tape has good adhesive strength and higher cohesion with no unpleasant odor of the thiol compound.

摘要翻译： 在制造可辐射固化压敏粘合带的方法中，当在包含液体低聚物和硫醇化合物的粘合剂组合物的涂布之前将季铵盐作为底涂层涂布在基材上时，所得粘合带具有良好的粘合强度 和更高的凝聚力，没有硫醇化合物的不愉快的气味。

公开(公告)号：US09250359B2

公开(公告)日：2016-02-02

申请号：US13259104

申请日：2010-02-12

申请人： Tomohisa Ohta

发明人： Tomohisa Ohta

IPC分类号： B32B38/10 ,  B32B7/02 ,  B05D3/04 ,  G02B1/10 ,  B29D11/00 ,  G02B1/04 ,  G02B5/30

CPC分类号： G02B1/14 ,  B29D11/00865 ,  G02B1/04 ,  G02B1/105 ,  G02B5/3025 ,  G02F2201/50 ,  Y10T156/1074 ,  Y10T428/2495 ,  Y10T428/24975 ,  C08L1/14

摘要： The object of the present invention is to prevent or suppress occurrences of uneven saponification and blocking, while improving cutting properties and dimensional stability. Specifically disclosed is a hard coat film (130) which comprises a protective film (114) for protecting a polarizer (112), and a hard coat layer (118) that is formed on the protective film (114). The sum of the thickness of the protective film (114) and the thickness of the hard coat layer (118) is less than 40 μm, and the mixed region of the protective film (114) and the hard coat layer (118) is 1-20% of the thickness of the hard coat layer (118).

摘要翻译： 本发明的目的是在改善切割性能和尺寸稳定性的同时防止或抑制不均匀皂化和粘连的发生。 具体公开了一种硬涂膜（130），其包括用于保护偏振片（112）的保护膜（114）和形成在保护膜（114）上的硬涂层（118）。 保护膜（114）的厚度和硬涂层（118）的厚度之和小于40μm，保护膜（114）和硬涂层（118）的混合区域为1 -20％的硬涂层（118）的厚度。