- 专利标题： Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
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申请号： US09055944申请日： 1998-04-07
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公开(公告)号： US06241581B1公开(公告)日： 2001-06-05
- 发明人: Naoto Miyashita , Yoshihiro Minami
- 申请人： Naoto Miyashita , Yoshihiro Minami
- 优先权： JP9-106804 19970410
- 主分类号： B24B100
- IPC分类号： B24B100
摘要：
A dresser is used which makes it possible to simultaneously dress and condition the surface of a polishing pad deteriorated by polishing a semiconductor wafer in the CMP process. The dresser is a dresser comprised of a ceramic such as dressing SiC, SiN, alumina or silica. Use of this dresser enables to shorten the time of dressing/conditioning the deteriorated polishing pad.
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