发明授权
- 专利标题： Polishing liquid supply apparatus
- 专利标题（中）： 抛光液供应装置
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申请号： US09471809申请日： 1999-12-23
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公开(公告)号： US06257965B1公开(公告)日： 2001-07-10
- 发明人: Noritaka Kamikubo , Yuji Satoh
- 申请人： Noritaka Kamikubo , Yuji Satoh
- 优先权： JP10-365844 19981224
- 主分类号： B24B719
- IPC分类号： B24B719
摘要：
A polishing liquid supply apparatus for supplying a polishing liquid to a chemical mechanical polishing apparatus includes a polishing liquid supply system including a polishing liquid tank for storing the polishing liquid; and a polishing liquid supply path for supplying the polishing liquid from the polishing liquid tank to the chemical mechanical polishing apparatus. The polishing liquid supply system is structured so as to shield the polishing liquid therein from external air.