发明授权
- 专利标题： Electronic component
- 专利标题（中）： 电子元器件
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申请号： US09460049申请日： 1999-12-14
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公开(公告)号： US06259593B1公开(公告)日： 2001-07-10
- 发明人: Nobushige Moriwaki , Shigeki Nishiyama
- 申请人： Nobushige Moriwaki , Shigeki Nishiyama
- 优先权： JP10-360498 19981218; JP11-283840 19991005
- 主分类号： H01G4005
- IPC分类号： H01G4005
摘要：
A coating layer composed of a solder containing tin as the major component and a metal such as copper or silver which is the same as that contained in a external electrode in an amount greater than the eutectic concentration, is formed on the external electrode. The solder can suppress the solid-phase diffusion without formation of the barrier layer.
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