公开(公告)号：US06741449B1

公开(公告)日：2004-05-25

申请号：US09376867

申请日：1999-08-18

申请人： Eliezer Pasternak

发明人： Eliezer Pasternak

IPC分类号： H01G4005

CPC分类号： H04B1/18 ,  H03B2201/0208 ,  H03B2201/025

摘要： A tunable element in the microwave frequency range is described that may include one or more tunable elements that are directly digitally controlled by a digital bus connecting a digital control circuit to each controlled element. In particular, each digital signal is filtered by a digital isolation technique so that the signal reaches the tunable elements with very low noise. The low noise digital signals are then converted to analog control voltages. The direct D/A conversion is accomplished by a special D/A converter which is manufactured as an integral part of a substrate. This D/A converter in accordance with the invention may consist of a resistor ladder or a directly digitally controlled capacitor. The direct digitally controlled capacitor may be a cantilevered type capacitor having multiple separate electrodes or sub-plates representing binary bits that may be used to control the capacitor. A low cost microwave oscillator is disclosed in which some of the filters and oscillators are direct digitally tuned elements.

摘要翻译： 描述了微波频率范围中的可调谐元件，其可以包括由连接数字控制电路到每个受控元件的数字总线直接数字控制的一个或多个可调谐元件。 特别地，每个数字信号被数字隔离技术滤波，使得信号以非常低的噪声到达可调谐元件。 然后将低噪声数字信号转换为模拟控制电压。 直接D / A转换是通过专门的D / A转换器来实现的，该D / A转换器被制造为衬底的一个组成部分。 根据本发明的该D / A转换器可以由电阻梯或直接数字控制的电容器组成。 直接数控电容器可以是具有多个分开的电极或表示可用于控制电容器的二进制位的子板的悬臂式电容器。 公开了一种低成本的微波振荡器，其中一些滤波器和振荡器是直接的数字调谐元件。

公开(公告)号：US06731493B2

公开(公告)日：2004-05-04

申请号：US10112588

申请日：2002-03-28

申请人： Dong Zhong ,  Jiangqi He ,  Yuan-Liang Li

发明人： Dong Zhong ,  Jiangqi He ,  Yuan-Liang Li

IPC分类号： H01G4005

CPC分类号： H01G4/232 ,  H01G4/30 ,  H01L23/32 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/00

摘要： An inter-digital capacitor may be used in a power socket for a microelectronic device. In one embodiment an integrated, low-resistance power and ground terminal configuration is disclosed. The capacitor plates are alternatively coupled to the power and ground terminals. Two polarity types are disclosed. A method of operation is also described.

摘要翻译： 在用于微电子器件的电源插座中可以使用数字间电容器。 在一个实施例中，公开了集成的低电阻功率和接地端子配置。 电容器板可选地耦合到电源和接地端子。 公开了两种极性类型。 还描述了一种操作方法。

公开(公告)号：US06661639B1

公开(公告)日：2003-12-09

申请号：US10188696

申请日：2002-07-02

申请人： Alan Devoe ,  Lambert Devoe ,  Hung Trinh

发明人： Alan Devoe ,  Lambert Devoe ,  Hung Trinh

IPC分类号： H01G4005

CPC分类号： H01G4/005 ,  H01G4/06 ,  H01G4/228 ,  H01G4/33

摘要： A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may contain an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor. Alternatively, the composite material may contain an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, the coated composite is mounted, and the coating provides an electrical connection to an internal electrode. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

摘要翻译： 具有高结构强度和电容的单片或基本单片单层电容器。 将绿色陶瓷电介质材料和陶瓷/金属复合材料片层压在一起，切割成单个芯片，并烧结以将陶瓷烧结在一起。 复合材料可以包含足以使复合导电的量的金属，由此复合材料可用于一个或两个电极和用于安装电容器。 或者，复合材料可以含有不足以使复合物导电但足以充当电镀工艺的种子点的金属量，其中复合材料优先用导电金属涂覆，涂覆的复合材料被安装，并且涂层提供电 连接到内部电极。 提供垂直取向的表面贴装电容器和混合电容器。

公开(公告)号：US06542351B1

公开(公告)日：2003-04-01

申请号：US09895771

申请日：2001-06-28

申请人： Kyuwoon Kwang

发明人： Kyuwoon Kwang

IPC分类号： H01G4005

CPC分类号： H01L28/82 ,  H01L23/5223 ,  H01L27/0805 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a capacitive structure of an integrated circuit a comb-like configuration or other thin element configuration provides for capacitive coupling between electrode elements in one plane. By forming electrodes in a plurality of planes and selectively shifting the positioning of the electrodes in one plane relative to those in another plane, capacitive coupling between the electrodes in the different planes is achieved. In this way capacitance and stability with process variations can be affected. Furthermore, by using the metal interconnect layers to form the capacitive structures, the need for additional process steps in defining poly-layers, is avoided.

摘要翻译： 在集成电路的电容结构中，梳状配置或其它薄元件配置提供了在一个平面中的电极元件之间的电容耦合。 通过在多个平面中形成电极并且相对于另一个平面中的电极在一个平面中选择性地移动电极的定位，实现了不同平面中的电极之间的电容耦合。 这样可以影响电容和稳定性与工艺变化。 此外，通过使用金属互连层形成电容结构，避免了限定多层的附加工艺步骤的需要。

公开(公告)号：US06487063B1

公开(公告)日：2002-11-26

申请号：US09715445

申请日：2000-11-16

申请人： Mamoru Nakasuji

发明人： Mamoru Nakasuji

IPC分类号： H01G4005

CPC分类号： H02N13/00 ,  H01L21/6833

摘要： Electrostatic chucks are disclosed for holding a wafer or other substrate during microlithographic transfer of a pattern from a reticle to a surface of the substrate using a charged particle beam or other energy beam. The chucks are configured especially to hold the substrate easily and completely for better substrate planarity and better conduction of heat from the substrate to the chuck during exposure. An embodiment of the chuck includes a base plate including a first region and a second region. The first region includes a central region and a peripheral segment region, and the second region includes a general peripheral region that, in combination with the peripheral segment region, surrounds the central region. An insulating layer overlies the base plate and defines a wafer-mounting surface. First and second electrode sets are situated between the base plate and insulating layer. The first electrode set is located in the first region so as to occupy the central region and peripheral segment region, and the second electrode set is located in the second region so as to occupy the general peripheral region. When initiating attachment of the substrate to the chuck, the first electrode set is energized before energizing the second electrode set.

摘要翻译： 公开了静电卡盘，用于在使用带电粒子束或其他能量束的图案从掩模版到基板的表面的微光刻转印期间保持晶片或其它基板。 卡盘被特别地配置成容易且完全地保持基板，以在曝光期间更好的基板平面性和更好地从基板传递到卡盘的热量。 卡盘的实施例包括包括第一区域和第二区域的基板。 第一区域包括中心区域和周边区域区域，第二区域包括与外围区段区域结合的中央区域的一般周边区域。 绝缘层覆盖基板并限定晶片安装表面。 第一和第二电极组位于基板和绝缘层之间。 第一电极组位于第一区域中，以占据中心区域和周边区域区域，并且第二电极组位于第二区域中，以占据一般的外围区域。 当启动基板与卡盘的附接时，在激励第二电极组之前，使第一电极组通电。

公开(公告)号：US06407905B1

公开(公告)日：2002-06-18

申请号：US09762289

申请日：2001-04-30

申请人： Joseph Connolly ,  Tommy Holmgren ,  Martin Carlen ,  Dennis Young-Cannon

发明人： Joseph Connolly ,  Tommy Holmgren ,  Martin Carlen ,  Dennis Young-Cannon

IPC分类号： H01G4005

CPC分类号： H01G4/012

摘要： A capacitor electrode includes a film base member having connection means located thereon so that the capacitor electrode may be connected to an external component, and a segmented metallized layer connected to the connection means, the metallized layer being made of metallized segments interconnected by current gates. The segmented,metallized layer has a thickness which varies or differs continuously along a length thereof, and the current gates have a width which increases as the thickness of the segmented metallized layer decreases.

摘要翻译： 电容器电极包括具有位于其上的连接装置的膜基部构件，使得电容器电极可以连接到外部部件，以及连接到连接装置的分段金属化层，金属化层由通过电流门互连的金属化段构成。 分段的金属化层具有沿其长度连续变化或不同的厚度，并且电流栅的宽度随着分段的金属化层的厚度减小而增加。

公开(公告)号：US06388863B1

公开(公告)日：2002-05-14

申请号：US09762655

申请日：2001-02-12

申请人： Kenichi Horie

发明人： Kenichi Horie

IPC分类号： H01G4005

CPC分类号： H01G4/35 ,  H01G4/40 ,  H03H1/02

摘要： An electronic part enabling a further efficient attenuation of high-frequency noises is provided. The first dielectric paste is applied onto a PET film (30) to form a ceramic sheet (31) having a dielectric constant ∈1 thereupon; and ceramic films (22—3, 22—4) are formed by applying the second dielectric paste on the ceramic sheet (31). Next, the pattern of the signal line (22—2) is printed by applying the conductive paste to the center of ceramic sheet (31) such that the right side (22—3a) of ceramic film (22—3) in the lengthwise direction and the left side (22—4a) of ceramic film (22—4) in the lengthwise direction are covered with the conductive paste; after that, further ceramic films (22—5, 22—6) are formed such that the lateral ends (22—2d, 22—2e) of the signal line (22—2) are sandwiched between the ceramic films (22—5, 22—6; and 22—3, 22—4).

摘要翻译： 提供了能够进一步有效衰减高频噪声的电子部件。 将第一电介质浆料施加到PET膜（30）上以形成其介电常数ε1的陶瓷片（31）; 并且通过将第二电介质浆料涂覆在陶瓷片（31）上而形成陶瓷膜（22-3,22-4）。 接下来，通过将导电膏施加到陶瓷片（31）的中心，使得沿长度方向的陶瓷膜（22-3a）的右侧（22-3a）被印刷，来印刷信号线（22-2）的图案 方向，陶瓷膜（22-4）的长度方向的左侧（22-4a）被导电膏覆盖; 之后，形成另外的陶瓷膜（22-5,22-6），使得信号线（22-2）的侧端（22-2d，22-2e）夹在陶瓷膜（22-5）之间 ，22-6;和22-3,22-4）。

公开(公告)号：US06208500B1

公开(公告)日：2001-03-27

申请号：US09200542

申请日：1998-11-25

申请人： Sam E. Alexander ,  Randy L. Yach ,  Roger St. Amand

发明人： Sam E. Alexander ,  Randy L. Yach ,  Roger St. Amand

IPC分类号： H01G4005

CPC分类号： H01L28/40 ,  H01L27/0805

摘要： An improved high quality factor capacitive device is implemented on a single, monolithic integrated circuit. The new layout techniques improve the quality factor (Q) of the capacitor by reducing intrinsic resistance of the capacitor by reducing the distance between the metal contacts of the top and bottom conductive plates. The layout techniques require laying out the top conductive plate of the capacitor in strips such that metal contacts from the bottom conductive plate pass in between the strips and through the dielectric layer. Alternatively, the apertures may be etched into the top conductive plate so that metal contacts pass through the apertures and connect to the bottom conductive plate.

摘要翻译： 改进的高品质因素电容器件在单个单片集成电路上实现。 新的布局技术通过减小顶部和底部导电板的金属触点之间的距离来降低电容器的固有电阻，从而提高了电容器的品质因数（Q）。 布局技术需要将带状电容器的顶部导电板布置成使得来自底部导电板的金属接触通过条带之间并通过介电层。 或者，孔可以被蚀刻到顶部导电板中，使得金属触点穿过孔并连接到底部导电板。

公开(公告)号：US06798640B1

公开(公告)日：2004-09-28

申请号：US10653832

申请日：2003-09-03

申请人： Istvan Novak

发明人： Istvan Novak

IPC分类号： H01G4005

CPC分类号： H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H05K1/0231 ,  Y10T29/43

摘要： A method for constructing a capacitor having an increased equivalent series resistance (ESR) is disclosed. In one embodiment, a capacitor includes a plurality of capacitor plates comprised of a conductive material and first and second capacitor terminals. At least one of the capacitor plates is coupled to the first terminal and at least one of the capacitor plates is coupled to the second terminal. At least one of the plurality of capacitor plates includes a pattern, wherein the pattern is void of conductive material. The void in the conductive material formed by the pattern may cause a path of current flow through the capacitor plate to be substantially altered in comparison to a capacitor plate that is continuous. By using capacitor plates having voids of conductive material that cause the current path to be altered in comparison to continuous capacitor plates, a capacitor can be constructed having a higher ESR.

摘要翻译： 公开了一种用于构造具有增加的等效串联电阻（ESR）的电容器的方法。 在一个实施例中，电容器包括由导电材料和第一和第二电容器端子组成的多个电容器板。 电容器板中的至少一个耦合到第一端子，并且电容器板中的至少一个耦合到第二端子。 所述多个电容器板中的至少一个包括图案，其中所述图案没有导电材料。 与连续的电容器板相比，由图案形成的导电材料中的空隙可能导致电流流经电容器板的路径基本上改变。 通过使用具有与连续电容器板相比导致电流路径改变的导电材料空隙的电容器板，可以构造具有较高ESR的电容器。

公开(公告)号：US06728092B2

公开(公告)日：2004-04-27

申请号：US09733815

申请日：2001-03-30

申请人： Andrew T. Hunt ,  Tzyy Jiuan Hwang ,  Helmut G. Hornis ,  Wen-Yi Lin

发明人： Andrew T. Hunt ,  Tzyy Jiuan Hwang ,  Helmut G. Hornis ,  Wen-Yi Lin

IPC分类号： H01G4005

CPC分类号： H05K1/162 ,  H01G4/085 ,  H05K3/388 ,  H05K3/467 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09309

摘要： Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

摘要翻译： 薄层电容器由第一柔性金属层，沉积在其上的约0.03和约2微米之间的电介质层和沉积在电介质层上的第二柔性金属层形成。 第一柔性金属层可以是金属箔，例如铜，铝或镍箔，或者沉积在聚合物支撑片上的金属层。 通过燃烧化学气相沉积或受控气氛化学气相沉积，这些层的沉积是或通过其促进的。