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公开(公告)号:US06574116B2
公开(公告)日:2003-06-03
申请号:US09866424
申请日:2001-05-25
IPC分类号: H05K702
摘要: An inverter capacitor module includes a plurality of substrates having a plurality of ceramic capacitors provided on the top surfaces thereof, and first and second feeding unit lands having conductive films provided on both surfaces thereof and arranged to feed the plurality of ceramic capacitors, the first and second feeding unit lands on both surfaces thereof being electrically connected to each other, a conductive spacer inserted between the plurality of substrates for establishing one of an electrical connection between the first feeding unit lands of an underlying substrate and its overlying substrate and an electrical connection between the second feeding unit lands of an underlying substrate and its overlying substrate, a fixing member arranged to fix the plurality of substrates laminated via the conductive spacer, and a switching module fixed below the bottom substrate among the plurality of substrates that are laminated. In the inverter capacitance module, the switching module is fixed to the plurality of substrates by the fixing element.
摘要翻译: 逆变器电容器模块包括多个基板,其多个陶瓷电容器设置在其顶表面上,第一和第二馈电单元焊盘具有设置在其两个表面上的导电膜,并布置成馈送多个陶瓷电容器,第一和第二馈电单元 插入在所述多个基板之间的导电间隔件,用于建立下面的基板的第一馈送单元平台与其上覆的基板之间的电连接之间的电连接和第二馈电单元的两个表面之间的电连接, 下部基板的第二馈送单元和其上覆的基板,经由导电间隔件固定多个基板的固定部件和固定在层叠的多个基板之中的底部基板下方的切换模块。 在逆变器电容模块中,开关模块通过固定元件固定到多个基板。
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公开(公告)号:US06473292B1
公开(公告)日:2002-10-29
申请号:US09468264
申请日:1999-12-20
申请人: Kazuhiro Yoshida , Shigeki Nishiyama , Nobushige Moriwaki , Takeshi Azumi , Yasuhiko Kubota , Yoshihiro Omura , Kazuyuki Kubota
发明人: Kazuhiro Yoshida , Shigeki Nishiyama , Nobushige Moriwaki , Takeshi Azumi , Yasuhiko Kubota , Yoshihiro Omura , Kazuyuki Kubota
IPC分类号: H01G400
CPC分类号: H01G4/30 , Y02T10/7022
摘要: Both of the longitudinal dimension L and the widthwise dimension W of a capacitor body are at least four times the thickness-wise dimension T, respectively. Preferably, the widthwise dimension W of the capacitor body 2 is greater than the longitudinal dimension L.
摘要翻译: 电容器主体的纵向尺寸L和宽度方向尺寸W分别为厚度方向尺寸T的至少四倍。 优选地,电容器主体2的宽度方向尺寸W大于纵向尺寸L.
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公开(公告)号:US06661641B2
公开(公告)日:2003-12-09
申请号:US10207406
申请日:2002-07-26
IPC分类号: H01G412
CPC分类号: H01G4/232 , H01F2027/295 , H01G4/228 , H05K3/3426 , H05K2201/10636 , H05K2201/10946 , Y02P70/611 , Y02P70/613
摘要: In a terminal member, a protuberance is formed so as to protrude toward an external electrode, and thereby, a bonding portion where the terminal member is bonded to the external electrode, the bonding portion being formed with solder, is extended substantially linearly across a part of the external electrode. Preferably, the direction in which the bonding portion is elongated linearly is in parallel to that in which internal electrodes are extended. Further, it is preferable that the bonding portion is as wide as possible, and the center of the bonding portion in the width direction is as near to the center of the end-face of the capacitor body as possible.
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公开(公告)号:US06583981B2
公开(公告)日:2003-06-24
申请号:US09993566
申请日:2001-11-27
IPC分类号: H01G406
CPC分类号: H01G2/08 , H01G4/38 , H01L2924/0002 , H05K1/141 , H05K1/18 , H05K1/181 , H01L2924/00
摘要: A ceramic condenser module includes at least one first multi-layered ceramic condenser and at least one second multi-layered ceramic condenser, which are mounted to a front surface and a back surface of a substrate, respectively. When a total surface area of the outside surfaces of the mounted first and second multi-layered ceramic condensers excluding surfaces thereof opposing the substrate is defined as S2, and a total equal to S2 and a surface area of the outside surface of the substrate excluding the area covered by the first and second multi-layered ceramic condensers is defined as S1, S1 is equal to or greater than about 1.3 times S2. With this arrangement, the ceramic condenser module is suitable for use with large amounts of current, has excellent heat-dissipation effect, is much smaller and much less expensive.
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公开(公告)号:US06570774B1
公开(公告)日:2003-05-27
申请号:US09526766
申请日:2000-03-16
IPC分类号: H05K702
摘要: The present invention provides a small-sized capacitor module for use in an inverter, which is capable of suppressing the occurrence of unwanted inductance components in an electric connection path and which is suitable for a large current use. The present capacitor module is constituted by: mounting a plurality of ceramic capacitors 3 having first and second terminals 3a and 3b on the first surface 1 of a substrate 2; forming a first conductor 12 on the first surface of the substrate 2; forming a second conductor 14 on the second surface of the substrate 2; electrically connecting first and second terminals 3a and 3b to the first conductor 12 and the second conductor 14, respectively; forming, on the substrate 2, first and second terminal mounting portions where the respective first and second terminals of a switching module are mounted; and electrically connecting the first and second terminal mounting portions to the first and second conductors 12 and 14, respectively.
摘要翻译: 本发明提供了一种用于逆变器的小型电容器模块,其能够抑制电连接路径中不期望的电感元件的出现并且适合于大电流使用。 本电容器模块由以下部分构成:将具有第一和第二端子3a和3b的多个陶瓷电容器3安装在基板2的第一表面1上; 在基板2的第一表面上形成第一导体12; 在基板2的第二表面上形成第二导体14; 将第一和第二端子3a和3b分别电连接到第一导体12和第二导体14; 在基板2上形成安装开关模块的各个第一和第二端子的第一和第二端子安装部分; 并且分别将第一和第二端子安装部分电连接到第一和第二导体12和14。
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公开(公告)号:US06259593B1
公开(公告)日:2001-07-10
申请号:US09460049
申请日:1999-12-14
IPC分类号: H01G4005
CPC分类号: H01G4/008 , B23K35/262 , H05K3/3442 , H05K3/3463
摘要: A coating layer composed of a solder containing tin as the major component and a metal such as copper or silver which is the same as that contained in a external electrode in an amount greater than the eutectic concentration, is formed on the external electrode. The solder can suppress the solid-phase diffusion without formation of the barrier layer.
摘要翻译: 在外部电极上形成由含有锡作为主要成分的焊料和与外部电极所含的金属相同的金属(例如铜或银)的涂层,其含量大于共晶浓度。 焊料可以抑制固相扩散而不形成阻挡层。
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公开(公告)号:US06574089B1
公开(公告)日:2003-06-03
申请号:US09464236
申请日:1999-12-15
IPC分类号: H01G206
CPC分类号: H01G4/232 , H01F2027/295 , H01G4/228 , H05K3/3426 , H05K2201/10636 , H05K2201/10946 , Y02P70/611 , Y02P70/613
摘要: In a terminal member, a protuberance is formed so as to protrude toward an external electrode, and thereby, a bonding portion where the terminal member is bonded to the external electrode, the bonding portion being formed with solder, is extended substantially linearly across a part of the external electrode. Preferably, the direction in which the bonding portion is elongated linearly is in parallel to that in which internal electrodes are extended. Further, it is preferable that the bonding portion is as wide as possible, and the center of the bonding portion in the width direction is as near to the center of the end-face of the capacitor body as possible.
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公开(公告)号:US08773833B2
公开(公告)日:2014-07-08
申请号:US13362497
申请日:2012-01-31
申请人: Toru Itabashi , Yuuki Mikami , Takahiko Furuta , Ryoichi Shiraishi , Hiroaki Nakamura , Shigeki Nishiyama
发明人: Toru Itabashi , Yuuki Mikami , Takahiko Furuta , Ryoichi Shiraishi , Hiroaki Nakamura , Shigeki Nishiyama
IPC分类号: H02H5/04
CPC分类号: H01H37/32 , H01H37/64 , H01H69/022 , H01H85/046 , H05K1/0293 , H05K1/111 , H05K3/3442 , H05K2201/09727 , H05K2201/10181
摘要: An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.
摘要翻译: 电子控制装置包括基板,设置在基板上的多个部件安装的线,安装在各个部件安装的导线上的多个电子部件,设置在基板上并与每个电子部件耦合的公共线, 连接在组件安装线中的一个和公共线之间的中断线,连接线,中断线通过该连接线与公共线中的一个和部件安装的线中的一个耦合,以及布置在每个之间的焊料 电子部件和相应的部件安装线中的一个并且具有比中断线更低的熔点。 中断线被配置为根据由过电流产生的热量熔化,以便中断一个部件安装的线和公共线之间的耦合。
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公开(公告)号:US20120200974A1
公开(公告)日:2012-08-09
申请号:US13362562
申请日:2012-01-31
申请人: Yuuki Mikami , Toru Itabashi , Takahiko Furuta , Ryoichi Shiraishi , Yusuke Takahashi , Hiroaki Nakamura , Shigeki Nishiyama
发明人: Yuuki Mikami , Toru Itabashi , Takahiko Furuta , Ryoichi Shiraishi , Yusuke Takahashi , Hiroaki Nakamura , Shigeki Nishiyama
CPC分类号: H02H5/047 , H01H85/046 , H01H85/08 , H01H85/10 , H05K1/0265 , H05K1/0293 , H05K2201/09263 , H05K2201/09727 , H05K2201/09736 , H05K2201/09781 , H05K2201/0989 , H05K2201/09909 , H05K2201/10181
摘要: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.
摘要翻译: 电子控制装置包括基板,多个部件安装导线,多个电子部件,公共线,中断线和保护层。 组件安装线和公共线设置在基板上。 电子部件安装在相应的部件安装的导线上并与公共线耦合。 中断线耦合在一个部件安装的线和公共线之间,并且被配置为根据由过电流产生的热量熔化,以中断部件安装的线和公共线之间的耦合。 保护层覆盖包括中断线的基板的表面,并且限定开口部分,使得中断线的至少一部分被暴露。
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公开(公告)号:US20110211306A1
公开(公告)日:2011-09-01
申请号:US12911608
申请日:2010-10-25
IPC分类号: G06F1/16
CPC分类号: G06F1/1662
摘要: According to one embodiment, an electronic device incorporates a housing, and a keyboard unit attached to the housing. The keyboard unit includes a plate-like base, a plurality of keys mounted on the base, a base cover including a plurality of through holes through which the keys are inserted, and a plurality of peripheral surfaces defining four sides of each of the through holes, and a hook portion provided in one of the peripheral surfaces of the base cover, and used to detach the keyboard unit from the housing.
摘要翻译: 根据一个实施例,电子设备包括壳体和附接到壳体的键盘单元。 键盘单元包括板状基座,安装在基座上的多个键,基座盖,其包括多个插入键的通孔,以及限定每个通孔的四个侧面的多个周边表面 以及设置在基座盖的外周面之一中的钩部,用于将键盘单元从壳体拆下。
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