Invention Grant
- Patent Title: Method of forming gate electrode with titanium polycide
- Patent Title (中): 用多晶硅化钛形成栅电极的方法
-
Application No.: US09456810Application Date: 1999-12-08
-
Publication No.: US06268272B1Publication Date: 2001-07-31
- Inventor: Se Aug Jang
- Applicant: Se Aug Jang
- Priority: KR98-57325 19981222
- Main IPC: H01L213205
- IPC: H01L213205

Abstract:
A method of forming a gate electrode with a titanium polycide which can prevent particle creation and abnormal oxidation of the gate electrode, is disclosed. In the present invention, a gate oxidation process is performed after implanting Si ions into the side wall or overall surface of the titanium silicide layer, thereby preventing abnormal oxidation of the titanium silicide during the gate oxidation process. Furthermore, a titanium silicide layer is deposited to a low mole ratio of Si/Ti, thereby minimizing particle creation.
Information query