发明授权
- 专利标题： Method for forming solder bumps
- 专利标题（中）： 形成焊锡凸块的方法
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申请号： US08659356申请日： 1996-06-06
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公开(公告)号： US06319810B1公开(公告)日： 2001-11-20
- 发明人: Masayuki Ochiai , Yasuo Yamagishi , Ichiro Yamaguchi , Masahiro Yoshikawa , Koki Otake , Masataka Mizukoshi , Yuuji Watanabe
- 申请人： Masayuki Ochiai , Yasuo Yamagishi , Ichiro Yamaguchi , Masahiro Yoshikawa , Koki Otake , Masataka Mizukoshi , Yuuji Watanabe
- 优先权： JP6-004751 19940120; JP7-145962 19950613; JP8-030567 19960219; JP8-078998 19960401
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.
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