公开(公告)号：US06319810B1

公开(公告)日：2001-11-20

申请号：US08659356

申请日：1996-06-06

申请人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Masataka Mizukoshi ,  Yuuji Watanabe

发明人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Masataka Mizukoshi ,  Yuuji Watanabe

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/48

摘要： Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.

摘要翻译： 在诸如其上形成有电极焊盘的半导体芯片的第一部件上形成焊料凸块的方法。 准备具有孔的平板，并通过挤压填充焊膏。 然后平板与第一构件重叠，平板在第一板上。 平板和第一构件被加热到高于焊膏中的焊料合金的熔点的温度。 因此，可以获得具有相同尺寸和均匀结构的焊料凸块。

公开(公告)号：US4676127A

公开(公告)日：1987-06-30

申请号：US785553

申请日：1985-10-08

申请人： Yuuji Watanabe

发明人： Yuuji Watanabe

IPC分类号： B23B29/034 ,  B23Q17/22 ,  B23B25/04 ,  B23B25/06

CPC分类号： B23B29/03439 ,  B23B29/03407 ,  B23Q17/22 ,  B23B2260/088 ,  B23B2270/48 ,  Y10T408/175 ,  Y10T408/21 ,  Y10T408/8598 ,  Y10T408/98 ,  Y10T409/30392 ,  Y10T409/308176 ,  Y10T409/3084 ,  Y10T82/12 ,  Y10T82/2502

摘要： The invention has as an object to provide a reliable, failure-free tool holding apparatus which allows digitization of a tool holding apparatus having a tool moving function, is free from various problems encountered upon digitization, and does not cause an erroneous operation upon scattering and attachment of chips or cutting oil. In order to achieve this object, a scale member and a moving amount detecting means are arranged to oppose each other. The scale member is arranged at the side of a slide movable in a predetermined direction, and is moved following the movement of the slide. The moving amount detecting means is arranged at the side of the main body and supplies a predetermined number of oscillation pulses to a display in accordance with the moving amount of the scale member. The scale member is enclosed with stretchable members such as bellows members, and is moved in the enclosed, sealed space.

摘要翻译： 本发明的目的是提供一种可靠的，无故障的工具保持装置，其允许具有工具移动功能的工具保持装置的数字化，在数字化时没有遇到的各种问题，并且不会在散射时引起错误的操作， 连接芯片或切削油。 为了达到这个目的，一个比例构件和一个移动量检测装置被布置为彼此相对。 标尺构件布置在可沿预定方向移动的滑块的侧部，并且随着滑块的移动而移动。 移动量检测装置设置在主体的侧面，并根据标尺件的移动量向显示器提供预定数量的振荡脉冲。 标尺构件被诸如波纹管构件的可拉伸构件包围，并且在封闭的密封空间中移动。