发明授权
- 专利标题: Multi-layer capacitor, wiring board, and high-frequency circuit
- 专利标题(中): 多层电容器,接线板和高频电路
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申请号: US09678937申请日: 2000-10-04
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公开(公告)号: US06327134B1公开(公告)日: 2001-12-04
- 发明人: Yoichi Kuroda , Masaaki Taniguchi , Yasuyuki Naito , Haruo Hori , Takanori Kondo , Michihiro Murata
- 申请人: Yoichi Kuroda , Masaaki Taniguchi , Yasuyuki Naito , Haruo Hori , Takanori Kondo , Michihiro Murata
- 优先权: JP11-294908 19991018
- 主分类号: H01G4005
- IPC分类号: H01G4005
摘要:
A multi-layer capacitor includes first and second side-surface terminal electrodes alternately arranged on four side surfaces of a capacitor body. First and second major-surface terminal electrodes are arranged on a major surface of the capacitor body. First and second internal electrodes which are opposed to each other within the capacitor body are respectively electrically connected at ends thereof to the first and second side-surface terminal electrodes, and are also respectively electrically connected to the first and second major-surface terminal electrodes through via hole conductors. With this arrangement, the directions of the currents flowing within the multi-layer capacitor are diversified, and the lengths of current-carrying paths are shortened so as to achieve a very low ESL value.
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